Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-viscosity and high-thermal-conductivity two-component potting silica gel

A high thermal conductivity, low viscosity technology, applied in the direction of heat exchange materials, adhesives, polymer adhesive additives, etc., can solve the problems of viscosity increase, limit the thermal conductivity of potting silica gel, etc., to prolong the service life and ensure work Stability and reliability, homogeneous mixing effect

Pending Publication Date: 2021-12-28
YANTAI DARBOND TECH
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The filling of powder often increases the viscosity a lot, and the filling amount of thermal conductive material limits the thermal conductivity of potting silica gel.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-viscosity and high-thermal-conductivity two-component potting silica gel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Weigh 10 parts of vinyl silicone oil with a viscosity of 3000mPa.s, 10 parts of vinyl silicone oil with a viscosity of 200mPa.s, 1 part of hydrogen-containing silicone oil, 15 parts of aluminum hydroxide with an average particle size of 5 μm, and spherical alumina powder with an average particle size of 40 μm 25 parts of carbon black and 0.5 parts of carbon black were sequentially added into a double planetary power mixing mixer, and mechanically stirred for 2 hours under the conditions of vacuum degree -0.1MPa, rotation speed of 400 rpm, and revolution speed of 8 rpm to obtain a composite Point A, packaged and placed for use.

[0033] Weigh 10 parts of vinyl silicone oil with a viscosity of 3000mPa.s, 10 parts of vinyl silicone oil with a viscosity of 200mPa.s, 0.1 part of platinum catalyst with a concentration of 5000ppm, and 15 parts of aluminum hydroxide with an average particle size of 5μm and an average particle size of 40μm 25 parts of spherical alumina powder an...

Embodiment 2

[0038] Weigh 50 parts of vinyl silicone oil with a viscosity of 2000mPa.s, 10 parts of hydrogen-containing silicone oil, 30 parts of aluminum hydroxide with an average particle size of 5 μm, and 10 parts of spherical alumina powder with an average particle size of 0.1 μm and a spherical shape with an average particle size of 5 μm 20 parts of alumina powder, 30 parts of spherical alumina powder with an average particle size of 30 μm, and 5 parts of iron red are added to the double planetary power mixer in turn, and the vacuum degree is -0.1MPa, and the rotation speed is 400 rpm. Under the condition of a speed of 8 revolutions / min, mechanical stirring was performed for 2 hours to obtain component A, which was packaged and placed for use.

[0039] Weigh 55 parts of vinyl silicone oil with a viscosity of 2000mPa.s, 1 part of platinum catalyst with a concentration of 5000ppm, 30 parts of aluminum hydroxide with an average particle size of 5 μm, 10 parts of spherical alumina powder w...

Embodiment 3

[0045] Weigh 35 parts of vinyl silicone oil with a viscosity of 1000mPa.s, 5 parts of hydrogen-containing silicone oil, 25 parts of spherical aluminum nitride powder with an average particle size of 5 μm, 40 parts of spherical alumina powder with an average particle size of 50 μm, and 3 parts of iron red , put into the double planetary power mixing mixer in turn, under the conditions of vacuum degree -0.1MPa, rotation speed of 400 rpm, and revolution speed of 8 rpm, mechanically stir for 2 hours to obtain component A, pack and store for use.

[0046] Weigh 38 parts of vinyl silicone oil with a viscosity of 1000mPa.s, 0.5 parts of platinum catalyst with a concentration of 5000ppm, 25 parts of spherical aluminum nitride powder with an average particle size of 5 μm, 40 parts of spherical alumina powder with an average particle size of 50 μm, carbon Add 3 parts of black into the double planetary power mixing mixer in turn, then add into the double planetary power mixing mixer in tu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a low-viscosity and high-thermal-conductivity two-component potting silica gel which is composed of a component A and a component B. The component A is composed of the following raw materials: 40-90 parts of a thermal conductive material, 20-50 parts of low-viscosity liquid silicone oil, 1-10 parts of a cross-linking agent, and 0.5-5 parts of a toner. The component B is prepared from the following raw materials in parts by weight: 40-90 parts of a heat-conducting material, 20-55 parts of low-viscosity liquid silicone oil, 0.04-1 part of a catalyst and 0.5-5 parts of a toner. The potting silica gel disclosed by the invention is good in flowability and high in thermal conductivity, the reliability and stability of an electronic device are improved, and the service life of the electronic device is prolonged.

Description

technical field [0001] The invention relates to a two-component potting silica gel with low viscosity and high thermal conductivity, belonging to the field of potting adhesives. Background technique [0002] With the application and development of integrated circuits in the electronic field, electronic components have become smaller, and thermal resistance and heating components are denser, making it more and more difficult to dissipate heat from electronic materials, greatly reducing the service life and safety of electronic components . Therefore, in order to make the electronic components dissipate better, a thermally conductive adhesive with high thermal conductivity is filled inside the electronic components to increase the thermal conductivity of the electronic components, thereby improving the heat dissipation efficiency of the device, prolonging the service life of the device, and increasing the thermal conductivity of the device. security. [0003] Silicone silico...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/08C09K5/14
CPCC09J183/04C09J11/04C09J11/08C09K5/14C08K2003/2227C08K2003/282C08K2003/2296C08K2003/0806C08L83/04C08K3/22C08K7/18C08K3/28C08K3/08
Inventor 林春霞王建斌陈田安谢海华
Owner YANTAI DARBOND TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com