Transmission interconnect structure for matching terahertz waveguides to substrate-integrated waveguides

A substrate-integrated waveguide and interconnection structure technology, applied in the electronic field, can solve the problems of difficult processing and assembly, and achieve the effect of reducing the difficulty of processing and assembly

Active Publication Date: 2022-05-03
GBA BRANCH OF AEROSPACE INFORMATION RES INST CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the submillimeter wave, especially in the terahertz frequency band, the metal waveguide-planar transmission line conversion structure usually adopts microstrip probes, ridge waveguide conversion and other schemes. In order to achieve sufficient matching conversion bandwidth, a quarter-wavelength short-circuit surface must be used or inside the waveguide. Adding a gradient ridge structure, there are challenges such as processing and assembly difficulties

Method used

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  • Transmission interconnect structure for matching terahertz waveguides to substrate-integrated waveguides
  • Transmission interconnect structure for matching terahertz waveguides to substrate-integrated waveguides
  • Transmission interconnect structure for matching terahertz waveguides to substrate-integrated waveguides

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Embodiment Construction

[0042] In this example, refer to figure 1 with figure 2 , the transmission interconnection structure used to match the terahertz waveguide and the substrate-integrated waveguide includes a first rectangular feeding waveguide 201 and a dielectric substrate 100, wherein the rectangular feeding waveguide is provided with a first feeding port 301, and the upper surface of the dielectric substrate 100 The surface 102 is provided with a metal layer, and the lower surface 101 of the dielectric substrate 100 is provided with a metal ground; the side of the upper surface 102 of the dielectric substrate 100 is attached to the first rectangular feeding waveguide 201 . The dielectric substrate 100 is provided with a first stepped groove 401, the first stepped groove 401 has a stepped edge profile extending along the first direction, the dielectric substrate 100 is provided with a first metal wall 501, and the first metal wall 501 is located on the first step On the side opposite to the ...

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Abstract

The invention discloses a transmission interconnection structure for matching a terahertz waveguide and a substrate integrated waveguide, comprising a first rectangular feeding waveguide and a dielectric substrate, the rectangular feeding waveguide is provided with a first feeding port, the dielectric substrate and a second dielectric substrate A rectangular feeding waveguide is attached, the dielectric substrate is provided with a first stepped groove with a stepped edge profile extending along the first direction, a first metal wall is provided on one side of the first stepped groove, and the first stepped groove The part and the first metal wall are both aligned with the first feed port, and the dielectric substrate is provided with a plurality of metal columns, and each metal column is respectively arranged on both sides of the first stepped groove along the first direction. The invention can realize impedance matching and mode conversion from a rectangular terahertz waveguide to a substrate integrated waveguide; since there is no need to use a quarter-wavelength short-circuit surface, and no need to additionally process a gradient ridge structure inside the waveguide, it is easy to use PCB and other manufacturing processes. out, reducing the difficulty of processing and assembly. The invention is widely used in the field of electronic technology.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a transmission interconnection structure for matching a terahertz waveguide and a substrate integrated waveguide. Background technique [0002] Communication and radar electronic systems are developing toward greater data transmission rates and higher detection accuracy. In order to meet performance development requirements, radar communication frequencies must develop toward higher frequency bands, which have gradually developed from microwave and millimeter wave frequency bands to terahertz frequency bands. The antenna and transceiver front-end circuit of the millimeter-wave terahertz radar communication system usually use transmission lines such as waveguides, microstrips, coplanar waveguides, or substrate-integrated waveguides. Functional modules such as antennas and transceiver front-ends often use different transmission lines, which involve conversion design issues betw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/107H01P5/10
CPCH01P5/107H01P5/10
Inventor 吴鹏刘克彬
Owner GBA BRANCH OF AEROSPACE INFORMATION RES INST CHINESE ACAD OF SCI
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