Laser cutting protection liquid as well as preparation method and application thereof

Abstract

The invention provides laser cutting protection liquid as well as a preparation method and application thereof. The laser cutting protection liquid is prepared from a combination of water-soluble resin, an azeotropic solvent, polyol, a water-soluble ultraviolet absorbent, a water-soluble antioxidant, a pH regulator and an anticorrosive agent, wherein the azeotropic solvent is composed of water and a high-boiling-point solvent with the boiling point higher than 145 DEG C, and the mass ratio of the water to the high-boiling-point solvent is (3-11): 1. According to the laser cutting protection liquid, the azeotropic solvent is used, the polyhydric alcohol, the water-soluble ultraviolet absorbent and the water-soluble antioxidant are added, and the mutual synergistic effect of all the components is utilized, so that the laser cutting protection liquid solves the problem that after an existing cutting protection liquid is used, carbonization residues are serious, and the photoelectric property of a chip is improved.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, and in particular relates to a laser cutting protective liquid and its preparation method and application. Background technique [0002] With the continuous expansion of the high-brightness LED market, improving the production capacity, efficiency and yield of products has become the primary issue at present; The blade set on the tool performs cutting action on the chip to be cut to realize the separation action; when cutting some high-hardness chips, it is necessary to use laser cutting and slotting first, and laser ablation processing takes into account efficiency, pass rate and cost. However, as the feature size of semiconductor integrated circuits continues to shrink, during the separation process, it is easy to leave impurities such as wax layer, dirt, and circuit oxidation residues on the surface of the chip. The residual impurities contain active oxidizing components. Oxidation comp...

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Problems solved by technology

[0007] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a laser cutting protection solution and its preparation method and application. The laser cutting protection solution solves the problem of serious carbonization residues on the chip surface after the use of the existing cutting protection solution. Help to improve the optoelectronic performance of the chip

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