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Low-heat-release epoxy resin composition and preparation method thereof

A technology of epoxy resin and epoxy resin with epoxy value, which is applied in the field of low-calorie epoxy resin composition and its preparation, can solve the problems of short storage time, difficulty in control, product scorching, etc., and achieve long storage period, Guaranteed manufacturability and reduced heat release

Pending Publication Date: 2021-12-14
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In recent years, the new technology industry has developed continuously, and higher requirements have been put forward for the performance and use of epoxy resin. However, the existing epoxy resin glue will generate a lot of heat when curing, and the curing heat release will affect the production of large composite products. If the curing reaction is concentrated, it will cause local overheating on the one hand, resulting in uneven curing of the product and internal stress, making the quality of epoxy resin products worse; on the other hand, the entire curing system is overheated, making the reaction The rate is too fast, it is not easy to control, and it will cause the product to scorch and even cause danger, so it is necessary to reduce the heat release of the curing reaction of epoxy resin
[0003] The existing methods for preparing low-heat-emitting epoxy resins mainly use low-temperature curing agents to reduce the curing reaction temperature of epoxy resins. However, low-temperature curing agents have high reactivity and short storage time at room temperature, which cannot meet the needs of large-scale parts. Laying cycle, poor manufacturability; therefore, it is necessary to study an epoxy resin with low heat release, long storage time and good manufacturability

Method used

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  • Low-heat-release epoxy resin composition and preparation method thereof

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preparation example Construction

[0047] The present invention also provides a preparation method of the above-mentioned low heat-generating epoxy resin composition, the preparation method comprising the steps of:

[0048] (1) Obtain mixture I after stirring low-viscosity epoxy resin and curing agent;

[0049] (2) Add curing agent, accelerator and defoamer optionally to mixture I described in step (1), and stir to obtain mixture II;

[0050] (3) Add the epoxy resin with low epoxy value into the mixture II described in step (2), and stir to obtain the epoxy resin composition with low exothermic heat.

[0051] According to some preferred embodiments, the curing agent in step (1) is a first curing agent; wherein, the first curing agent is an aromatic amine curing agent;

[0052] According to some more preferred embodiments, the mass ratio of the low-viscosity epoxy resin to the first curing agent is 100:(5-20) (for example, it can be 100:5, 100:8, 100:10 , 100:13, 100:15, 100:18 or 100:20);

[0053] According ...

Embodiment 1

[0066] (1) Mix 80 parts of low-viscosity epoxy resin (bisphenol A epoxy resin E-51: viscosity is 12000mPa·s) and 7 parts of aromatic amine curing agent (diaminodiphenyl sulfone (DDS)) , stirred at 80°C for 1.5 hours to obtain mixture I;

[0067] (2) Add 5 parts of dicyandiamide curing agent (Dicyandiamide (Dicy)), 1 part of substituted urea accelerator (UR300) and 1 part of defoamer to the mixture I described in step (1) (BYK-P 9920), stirred at room temperature (25°C) to obtain mixture II;

[0068] (3) Add 15 parts of low epoxy value epoxy resin (bisphenol A type epoxy resin E-20: epoxy value 0.2) to the mixture II described in step (2), at room temperature (25°C ) stirring to obtain a low exothermic epoxy resin composition.

Embodiment 2

[0070] Example 2 is basically the same as Example 1, except that the low-viscosity epoxy resin is 70 parts, and the low epoxy value epoxy resin is 20 parts.

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Abstract

The invention provides a low-heat-release epoxy resin composition and a preparation method thereof, the low-heat-release epoxy resin composition comprises an epoxy resin mixture, a curing agent and an accelerant, wherein the epoxy resin mixture is composed of low-viscosity epoxy resin and low-epoxy-value epoxy resin, the content of the low-viscosity epoxy resin is 50-80 parts by mass, the content of the low-epoxy-value epoxy resin is 15-30 parts by mass, the content of the curing agent is 4-16 parts by mass, the content of the accelerant is 0.5-5.5 parts by mass, the viscosity of the low-viscosity epoxy resin ranges from 10,000 mPa.s to 15,000 mPa.s, the epoxy value of the low-epoxy-value epoxy resin is not higher than 0.3, and a mass ratio of the low-viscosity epoxy resin to the low-epoxy-value epoxy resin is (50-80): (15-30). The epoxy resin composition prepared by the invention has the advantages of low heat release in curing reaction, long storage time and good manufacturability.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a low-calorie epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin is widely used in various fields due to its excellent performance and low cost. In recent years, the new technology industry has developed continuously, and higher requirements have been put forward for the performance and use of epoxy resin. However, the existing epoxy resin glue will generate a lot of heat when curing, and the curing heat release will affect the production of large composite products. If the curing reaction is concentrated, it will cause local overheating on the one hand, resulting in uneven curing of the product and internal stress, making the quality of epoxy resin products worse; on the other hand, the entire curing system is overheated, making the reaction If the rate is too fast, it is not easy to control, and it will cause the pro...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/56C08G59/40C08G59/68
CPCC08L63/00C08G59/56C08G59/4021C08G59/686C08L2205/025
Inventor 石悦董大为欧秋仁
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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