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Crucible lifting and rotating mechanism special for silicon carbide furnace

A silicon carbide furnace, lifting and rotating technology, applied in the direction of crucible furnace, furnace, furnace type, etc., can solve the problems of lifting and unfavorable pulling single crystal quality

Pending Publication Date: 2021-12-07
SHANGHAI HANHONG PRECISION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the change of semiconductor materials, if the traditional crucible lifting and rotating device is still used, it is not conducive to ensuring the improvement of the quality of single crystal pulling
At present, there is a lack of a crucible lifting and rotating device for silicon carbide, which is suitable for the third generation of semiconductor materials.

Method used

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  • Crucible lifting and rotating mechanism special for silicon carbide furnace
  • Crucible lifting and rotating mechanism special for silicon carbide furnace
  • Crucible lifting and rotating mechanism special for silicon carbide furnace

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Experimental program
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Effect test

Embodiment Construction

[0057] The present invention will be further described below in conjunction with the accompanying drawings.

[0058] see Figure 1 to Figure 4 , specific embodiment 1: special crucible lifting and rotating mechanism for silicon carbide furnace, including a lifting mechanism, a rotating mechanism is installed on the lifting slide table 15 of the lifting mechanism, and the rotating mechanism includes a rotating shaft 32, and the rotating shaft 32 passes through the magnetic fluid rotating seal 28 and The lifting slide 15 is rotationally connected; the periphery of the magnetic fluid rotary seal 28 is connected with the lower end of the bellows device 31, and the upper end of the bellows device 31 is the upper flange of the bellows for connecting the bottom chamber of the silicon carbide furnace; the rotating shaft 32 The lower end is rotatably connected with a rotary joint 18, and the rotary joint 18 is provided with a water inlet and a water outlet; the rotating shaft 32 is pro...

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Abstract

The invention relates to the field of semiconductor equipment, in particular to a crucible lifting and rotating mechanism special for a silicon carbide furnace. The mechanism comprises a lifting mechanism, a rotating mechanism is installed on a lifting sliding table of the lifting mechanism, the rotating mechanism comprises a rotating shaft, and the rotating shaft is rotationally connected with the lifting sliding table through a magnetofluid rotary sealing piece; the periphery of the magnetofluid rotary sealing piece is connected with the lower end of a corrugated pipe device; the upper end of the corrugated pipe device is a corrugated pipe upper flange for connecting a silicon carbide furnace bottom cavity; the lower end of the rotating shaft is rotationally connected with a rotating joint which is provided with a water inlet and a water outlet; and a cooling loop is arranged in the rotating shaft, one end of the cooling loop is communicated with the water inlet, and the other end of the cooling loop is communicated with the water outlet. The magnetofluid rotary sealing piece is additionally arranged, so that the rotating effect and the high-vacuum sealing effect are achieved. High sealing performance between the rotating position and a silicon carbide furnace inner cavity is conveniently achieved, then the high vacuum degree of the silicon carbide furnace inner cavity can be guaranteed, and the mechanism is suitable for processing and production of third-generation semiconductor materials.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a lifting and rotating mechanism. Background technique [0002] The crucible lifting and rotating device is one of the core transmission components of the silicon carbide furnace. [0003] With the vigorous development of the semiconductor industry, semiconductor materials have evolved from the first generation to the current third generation. The representative silicon of the first-generation semiconductor material has a power of about 100W, but the frequency is only about 3GHz; the second-generation representative gallium arsenide has a power of less than 100W, but the frequency can reach 100GHz. Therefore, the first two generations of semiconductor materials are more complementary to each other. Gallium nitride and silicon carbide, the representatives of the third-generation semiconductor, can have a power of more than 1000W and a frequency close to 100GHz. The advanta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F27B14/04F27B14/08F27B14/10
CPCF27B14/04F27B14/08F27B14/10F27B2014/045F27B2014/0831F27B2014/0837
Inventor 夏孝平贺贤汉徐淑文张城
Owner SHANGHAI HANHONG PRECISION MACHINERY
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