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Dicyclopentadiene/epoxy resin compound and preparation method thereof

A technology of dicyclopentadiene and epoxy resin, which is applied in the field of dicyclopentadiene/epoxy resin compound and its preparation, can solve the problems of unrelated material dielectric properties, unfavorable industrial production, cumbersome operation, etc., and achieve good The effect of industrialized production basis, low production cost and simple operation process

Pending Publication Date: 2021-12-03
SHANGHAI ZHONGHUA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process in the above-mentioned documents all includes the step of reacting the acid anhydride curing agent and the DCPD monomer at high temperature (120°C-140°C) for 2-3 hours under the protection of nitrogen, which is cumbersome and costly, which is not conducive to Industrial production
Moreover, none of the above documents deal with the dielectric properties of materials

Method used

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  • Dicyclopentadiene/epoxy resin compound and preparation method thereof
  • Dicyclopentadiene/epoxy resin compound and preparation method thereof
  • Dicyclopentadiene/epoxy resin compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0114] 1. The formula of dicyclopentadiene / epoxy resin compound

[0115] Each raw material component of the dicyclopentadiene / epoxy resin compound of embodiment 1 is as follows: dicyclopentadiene 5g; Bisphenol A epoxy resin YN1828 (purchased from Jiangsu Yangnong Jinhu Chemical Co., Ltd., epoxy value 0.51-0.54) 95g; dicyandiamide curing agent 3.8g; 2-methylimidazole 0.38g; Grubbs second-generation catalyst 0.0024g; N,N-dimethylformamide 3.5g; toluene 0.25g.

[0116] 2. Preparation process of dicyclopentadiene / epoxy resin compound

[0117] The preparation technology of the dicyclopentadiene / epoxy resin compound of embodiment 1 is as follows:

[0118] (1) Stir dicyclopentadiene and epoxy resin at a high speed for 30 minutes at 40°C to make them evenly mixed;

[0119] (2) Dissolve 2-methylimidazole in N,N-dimethylformamide, add dicyandiamide curing agent into the resin solution obtained in step (1), and stir mechanically at 40°C for 90 minutes at high speed;

[0120] (3) Grubb...

Embodiment 2

[0123] 1. The formula of dicyclopentadiene / epoxy resin compound

[0124] Each raw material component of the dicyclopentadiene / epoxy resin compound of embodiment 2 is as follows: dicyclopentadiene 10g; Bisphenol A type epoxy resin YN1828 (purchased from Jiangsu Yangnong Kumho Chemical Co., Ltd. 0.51-0.54) 90g; dicyandiamide curing agent 3.6g; 2-methylimidazole 0.35g; Grubbs second-generation catalyst 0.0049g; N,N-dimethylformamide 3.5g; toluene 0.25g.

[0125] 2. Preparation process of dicyclopentadiene / epoxy resin compound

[0126] The preparation technology of the dicyclopentadiene / epoxy resin compound of embodiment 2 is as follows:

[0127] (1) Stir dicyclopentadiene and epoxy resin at a high speed for 30 minutes at 40°C to make them evenly mixed;

[0128] (2) Dissolve 2-methylimidazole in N,N-dimethylformamide, add dicyandiamide curing agent into the resin solution obtained in step (1), and stir mechanically at 40°C for 90 minutes at high speed;

[0129] (3) Grubbs secon...

Embodiment 3

[0132] 1. The formula of dicyclopentadiene / epoxy resin compound

[0133] Each raw material component of the dicyclopentadiene / epoxy resin compound of embodiment 3 is as follows: dicyclopentadiene 20g; Bisphenol A epoxy resin YN1828 (purchased from Jiangsu Yangnong Jinhu Chemical Co., Ltd., epoxy value 0.51-0.54) 80g; dicyandiamide curing agent 3.2g; 2-methylimidazole 0.33g; Grubbs second-generation catalyst 0.01g; N,N-dimethylformamide 3.0g; toluene 0.35g.

[0134] 2. Preparation process of dicyclopentadiene / epoxy resin compound

[0135] The preparation technology of the dicyclopentadiene / epoxy resin compound of embodiment 3 is as follows:

[0136] (1) Stir dicyclopentadiene and epoxy resin at a high speed for 30 minutes at 40°C to make them evenly mixed;

[0137] (2) Dissolve 2-methylimidazole in N,N-dimethylformamide, add dicyandiamide curing agent into the resin solution obtained in step (1), and stir mechanically at 40°C for 90 minutes at high speed;

[0138](3) Grubbs ...

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Abstract

The invention discloses a dicyclopentadiene / epoxy resin compound and a preparation method thereof. The preparation method comprises the steps that dicyclopentadiene monomers, epoxy resin, an epoxy resin curing agent and a curing accelerator are evenly mixed, then an olefin polymerization catalyst is added, the epoxy resin and dicyclopentadiene are polymerized and cross-linked respectively, and thus a high-molecular polymer with an interpenetrating network structure is obtained. The dicyclopentadiene / epoxy resin compound has low dielectric constant and dielectric loss factor and good heat resistance, and can be widely applied to the manufacturing industry of high-frequency copper-clad plates.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a dicyclopentadiene / epoxy resin compound and a preparation method thereof. Background technique [0002] As my country promotes the development of next-generation information technologies such as big data, the Internet of Things, AI, and 5G, and accelerates the construction of products and application systems such as software, hardware, and equipment services, the market's demand for high-end printed circuit boards (PCBs) will grow exponentially. As the core raw material copper clad laminate (CCL) in PCB production products, its market size is also increasing. At the same time, with the high-speed and multi-functionalization of product information processing and the increase in the amount of transmitted information, copper-clad laminates are required to have higher high-frequency characteristics, lower dielectric constant and dielectric loss factor, and b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L45/00C08F132/08
CPCC08L63/00C08F132/08C08L2205/04C08L2203/16C08L2203/20C08L2201/08C08L45/00
Inventor 杨鲜锋毕淑梦凌达
Owner SHANGHAI ZHONGHUA TECH CO LTD
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