Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Temperature sensing assembly, manufacturing method thereof and thermometer

A technology of sensing components and heat-conducting parts, applied in thermometers, thermometer parts, thermometers using electric/magnetic elements that are directly sensitive to heat, etc., can solve the complex and cumbersome manufacturing process, detection process, temperature measurement efficiency and accuracy Low temperature, long heat balance time and other problems, to achieve the effect of shortening the steady state balance time of heat transfer, that is, the temperature measurement time, improving the temperature measurement efficiency and accuracy, and reducing the manufacturing cost

Pending Publication Date: 2021-11-30
广州讯达医疗科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The temperature sensor under this framework has a long thermal equilibrium time during the temperature measurement process, (armpit temperature measurement) generally takes 5 minutes or even longer, and the temperature measurement efficiency and accuracy are low, especially in the body surface (forehead) temperature measurement scene. The temperature value obtained is generally lower than the actual temperature of the body surface
In addition, under this framework, the manufacturing process and testing process are complex and cumbersome, and the cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temperature sensing assembly, manufacturing method thereof and thermometer
  • Temperature sensing assembly, manufacturing method thereof and thermometer
  • Temperature sensing assembly, manufacturing method thereof and thermometer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are part of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present disclosure.

[0031] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings.

[0032] refer to figure 1 , the embodiment of the present invention provides a temperature sensing component 1 , including a heat conducting element 10 , a heat sensitive element 20 and a circuit board 30 . In this embodiment, the heat conducting element 10 is a heat conducting ceramic sheet. Or in other embodiments, the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a temperature sensing assembly, a manufacturing method thereof, and a thermometer. The temperature sensing assembly comprises a heat conduction piece, a thermosensitive piece and a circuit board, the heat conduction piece is sealed on the circuit board, the thermosensitive piece is packaged between the heat conduction piece and the circuit board, the circuit board is provided with a blind hole whose size is larger than that of the thermosensitive piece, one side of the thermosensitive piece is in contact with the heat conduction piece, the other side of the thermosensitive piece is arranged in the blind hole, a heat insulation layer is formed between the thermosensitive piece and the inner wall of the blind hole in a spaced mode, and the thermosensitive piece is electrically connected with the circuit board. In terms of mechanical structure and circuit connection, through one-time operation of the sealing process, the purposes of electrical connection between the thermosensitive piece and the circuit board and airtight and watertight packaging between the heat conduction piece and the circuit board can be achieved at the same time, the process is effectively simplified, and the cost is reduced.

Description

technical field [0001] The present invention generally relates to the technical field of temperature measurement. More specifically, the present invention relates to a temperature sensing component, a manufacturing method thereof, and a thermometer. Background technique [0002] Traditional temperature sensors, especially armpit thermometers and temperature sensors on body surface (such as forehead) temperature measuring stickers, generally use stainless steel caps or stainless steel planes as heat conduction layers, and install thermistors inside or on the other side as temperature sensors. layer, and then fill the space around the thermistor with heat-conducting silicone grease and other materials to connect the temperature-sensing layer to the heat-conducting layer, and finally connect the thermistor to the detection chip, and the chip collects the thermistor value and converts it into a temperature value. The temperature sensor under this framework has a long thermal eq...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/22G01K7/18G01K1/022
CPCG01K7/22G01K7/18G01K1/022
Inventor 李光祥
Owner 广州讯达医疗科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products