Two-dimensional graphene prepared by vapor deposition method and preparation method thereof
A vapor deposition method, graphene technology, applied in the field of materials, can solve problems such as many defects, rough surface, poor performance, etc., and achieve the effect of saving cost and energy
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Embodiment 1
[0025] S11 Clean the copper foil, specifically soak the copper foil in HCl with a mass concentration of 18%, deionized water, acetone, and isopropanol, and ultrasonically clean it for 15 minutes; then dry it with nitrogen, and put it into a quartz tube after drying ;
[0026] After S12, use argon to purge the quartz tube 5 times to exhaust the air and most importantly, the oxygen in it, and then anneal the copper foil at 1000°C for 30 minutes under the condition that the flow rate of hydrogen is 110 sccm and the flow rate of argon is 390 sccm , to ensure the removal of natural oxides in the quartz tube and on the surface of the copper foil, and to increase the grain size of the copper to promote a smooth surface of the copper foil.
[0027] After the S13 annealing is completed, quickly cool to the graphene growth temperature of 300°C, adjust the hydrogen flow rate to 20 sccm, turn off the argon gas, and use the argon gas with a flow rate of 5 sccm to pump the benzene liquid wi...
Embodiment 2
[0033] S21 Clean the copper foil, specifically soak the copper foil in HCl with a mass concentration of 18%, deionized water, acetone, and isopropanol, and ultrasonically clean it for 17 minutes; then dry it with nitrogen, and put it into a quartz tube after drying ;
[0034] After S22, use argon to purge the quartz tube 5 times to exhaust the air and most importantly, the oxygen in it, and then anneal the copper foil at 1100°C for 30 minutes under the condition that the flow rate of hydrogen is 110 sccm and the flow rate of argon is 390 sccm , to ensure the removal of natural oxides in the quartz tube and on the surface of the copper foil, and to increase the grain size of the copper to promote a smooth surface of the copper foil.
[0035] After the S23 annealing is completed, it is rapidly cooled to the graphene growth temperature of 250°C, the hydrogen flow rate is adjusted to 20 sccm, the argon gas is turned off, and the benzene liquid with a mass concentration greater tha...
Embodiment 3
[0039] S31 Clean the copper foil, specifically soak the copper foil in HCl with a mass concentration of 18%, deionized water, acetone, and isopropanol, and ultrasonically clean it for 20 minutes; then dry it with nitrogen, and put it into a quartz tube after drying ;
[0040] After S32, use argon gas to purge the quartz tube 6 times to exhaust the air, and most importantly, the oxygen in it, and then anneal the copper foil at 1100°C for 30 minutes under the condition that the flow rate of hydrogen is 110 sccm and the flow rate of argon is 390 sccm , to ensure the removal of natural oxides in the quartz tube and on the surface of the copper foil, and to increase the grain size of the copper to promote a smooth surface of the copper foil.
[0041] After S33 annealing is completed, it is rapidly cooled to the graphene growth temperature of 200°C, the hydrogen flow rate is adjusted to 20 sccm, the argon gas is turned off, and the benzene liquid with a mass concentration greater th...
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