Glass substrate circuit printing method and equipment

Abstract

The invention relates to glass substrate circuit printing method and equipment. The equipment comprises an ultrahigh-precision motion control system which is connected with a computer and is used for controlling the movement speed and the printing receiving distance of a printing glass substrate circuit and a printing needle head; a sucker device is which connected with the ultrahigh-precision motion control system and comprises suckers for fixing a glass substrate; a height measurement and automatic following system which is connected with the computer and comprises a sensor and a sensor controller, wherein the sensor is used for measuring space coordinates of the glass substrate and the printing needle head; and a high-precision fluid control system which comprises a printing needle head and a fluid control system, wherein the fluid control system is used for providing preset air pressure for the printing needle head, the inner diameter of the printing needle head is matched with the preset printing line width, and the air pressure, the needle head movement speed and the printing receiving distance are matched with the printing needle head. According to the method and equipment, the printing yield and the production efficiency of the glass substrate circuit are improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a glass substrate circuit printing method and equipment. Background technique [0002] Since the 1950s, electronic equipment, including semiconductor equipment, has made great progress, among which printed circuit technology has played an important role. Printed circuits make mass production of electronic equipment easier and easier, making electronic equipment consistent in performance. Stable quality and compact structure. The printed circuit does not need to be soldered on the circuit board one by one, eliminating a lot of complicated manual wiring operations, and can achieve high precision, which greatly improves the production efficiency of the circuit board. [0003] The methods for printing circuits on glass in the prior art include the method of printing circuits by etching and electroplating and the method of printing circuits by printing. Among them, the printi...

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Problems solved by technology

[0004] However, the printing circuit method of etching and electroplating in the prior art has complicated process, high equipment cost, and serious pollution. The circuit made is easy to fall off due to poor adhesion of the material, and cannot be repaired after an error, resulting in the scrapping of the entire product. Shortcomings or deficiencies; the method of printing circuit by printing has complicated process and high equipment cost, and can only achieve flat printing, which cannot meet the printing requirements of spatial structure

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