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Long-wave infrared multispectral imaging device based on filter array and design method of device

A multi-spectral imaging and long-wave infrared technology, applied in the field of multi-spectral imaging, can solve problems such as inability to perform real-time imaging structures, unfavorable system miniaturization and integration, and complexity, and achieve simple structure, high integration, and simple structural form Effect

Pending Publication Date: 2021-11-19
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing methods for realizing long-wave infrared multispectral imaging include the use of filter wheels, sub-apertures, and use of tunable filters, etc., all of which cannot perform real-time imaging and have a complex structure, which is not conducive to the miniaturization and integration of the system

Method used

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  • Long-wave infrared multispectral imaging device based on filter array and design method of device
  • Long-wave infrared multispectral imaging device based on filter array and design method of device
  • Long-wave infrared multispectral imaging device based on filter array and design method of device

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Embodiment 1

[0064] In this embodiment, a 6-channel multi-spectral imaging device is designed for incident light signals in the long-wave infrared band with a wavelength range of 8.00-12.00 μm, and the 2×3 filter array structure is as follows figure 1 As shown, the size of each multilayer film structure matches the pixel size of the detector used, and the side length is 25.00 μm.

[0065] Using the above method, the CST software is used for parameter scanning and combined with the calculation of the transfer matrix method to optimize the material, number of layers and thickness of each film layer of the multilayer film structure. Specifically, the substrate of the multilayer film structure is BaF with thickness d=1.00mm 2 , the number of multilayer films is 7 layers, which is composed of 4 layers of Ge and 3 layers of ZnS alternately arranged, and the thickness is d 1 = 0.80 μm, d 2 = 1.00 μm, d 3 = 0.36 μm, d 4 、d 5 = 0.36 μm, d 6 = 1.00 μm, d 7 = 0.80 μm. Changing the thickness d...

Embodiment 2

[0069]In this embodiment, a 9-channel multi-spectral imaging device is designed for incident light signals in the long-wave infrared band with a wavelength range of 8.00 to 12.00 μm, in which the 3×3 filter array is as image 3 As shown, the size of each multilayer film structure matches the pixel size of the detector used, and the side length is 25.00 μm.

[0070] Using the above method, the CST software is used to scan parameters and combine with the calculation of the transfer matrix method to optimize the material, number of layers and thickness of each film layer of the multilayer film. Specifically, the substrate of the multilayer film structure is BaF with thickness d=1.00mm 2 , the number of layers of the multilayer film is 7 layers, consisting of 4 layers of Ge and 3 layers of BaF 2 Alternately arranged, the thickness is d 1 = 0.70 μm, d 2 = 1.10 μm, d 3 = 0.40 μm, d 4 、d 5 = 0.40 μm, d 6 = 1.10 μm, d 7 = 0.70 μm. Change the middle layer BaF 2 Thickness d 4...

Embodiment 3

[0074] In this embodiment, a 4-channel multi-spectral imaging device is designed for incident light signals in the long-wave infrared band with a wavelength range of 8.00-12.00 μm, in which the 2×2 filter array is as Figure 5 As shown, the size of each multilayer film structure matches the pixel size of the detector used, and the side length is 25.00 μm.

[0075] Using the above method, the CST software is used to scan parameters and combine with the calculation of the transfer matrix method to optimize the material, number of layers and thickness of each film layer of the multilayer film. Specifically, the substrate of the multilayer film structure is BaF with thickness d=1.00mm 2 , the number of layers of the multilayer film is 5 layers, consisting of 3 layers of Ge and 2 layers of BaF 2 Alternately arranged, the thickness is d 1 = 0.50 μm, d 2 = 0.80 μm, d 3 、d 4 = 0.80 μm, d 5 = 0.50 μm. Changing the thickness d of the interlayer Ge 3 The central wavelength of tra...

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Abstract

The invention discloses a long-wave infrared multispectral imaging device based on a filter array and a design method of the device. The multispectral imaging device can divide an incident light signal of a long-wave infrared band into a plurality of spectral channels, and comprises a substrate and a plurality of filter arrays periodically arranged on the substrate, and each filter array is formed by arranging a plurality of groups of multilayer film structures; the multi-layer film structure is an F-P cavity formed by alternately arranging high-refractive-index film layers and low-refractive-index film layers, and the number of the film layers of the multi-layer film structure is an odd number larger than 1; and the multiple groups of multi-layer film structures are configured to be capable of filtering incident light signals of a long-wave infrared band to obtain multiple beams of transmission light with different bandwidths and different central wavelengths so as to form multiple spectrum channels. The device is designed by combining electromagnetic simulation software with transmission matrix method calculation, has the advantages of simple structure, high integration level, real-time imaging and the like, and can be used for dangerous gas detection, environment monitoring, remote sensing and other scenes applying a long-wave infrared multispectral imaging technology.

Description

technical field [0001] The invention belongs to the technical field of multispectral imaging, and more specifically relates to a filter array-based long-wave infrared multispectral imaging device and a design method thereof. Background technique [0002] Spectral imaging technology is a new multi-dimensional information acquisition technology combining spectral technology and imaging technology, which can obtain two-dimensional spatial information and spectral information of the detected target. Multi-spectral imaging technology is a kind of spectral imaging technology. It uses spectroscopic technology to divide the incident broadband optical signal into several (usually several or a dozen) narrow-band spectral channels, so as to obtain images of different spectral channels, which can improve detection. The spectral resolution capability of the system can obtain richer information, extract and identify the characteristics of the target more effectively. [0003] As one of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J3/28G01J3/02G02B5/28G02B27/00
CPCG01J3/2823G01J3/0205G02B5/286G02B27/0012G01J2003/2826
Inventor 罗先刚李雄蒲明博马晓亮郝涵靳金金
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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