A method for manufacturing a chip alloy foil resistor

A manufacturing method and alloy foil technology, applied in the field of alloy foil resistors, can solve the problems of uneven current density distribution of foil materials, affecting product reliability, product stability, etc., and achieving small distribution parameters, low noise, and tracking temperature coefficient. small effect

Active Publication Date: 2022-03-11
BDS ELECTRONICS
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Problems solved by technology

However, there are the following two defects in the existing processing and production process. One is that during the etching process, if the photoresist adhesion is not good, part of the edge photoresist will fall off and cause foil side engraving, which not only affects the accuracy of the finished product Significant impact, and when the finished product is powered on, the current density distribution on the foil is uneven, which affects product reliability
The other is that stress will accumulate during product processing or defective products will have a great impact on product stability.

Method used

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  • A method for manufacturing a chip alloy foil resistor

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Effect test

Embodiment 1

[0033] like figure 1 As shown, the manufacturing method of the chip alloy foil resistor comprises the following steps:

[0034] 1. Substrate cleaning: Place the flower basket containing the substrate to be cleaned in deionized water with a frequency of 35KHz and a conductivity of less than 5μs / cm for 12 minutes, and then put it in absolute ethanol for 12 minutes. Dry in an oven at 98°C for 25 minutes;

[0035] 2. Foil cleaning: put the foil in 35kHz absolute ethanol for 12 minutes, and then clean it with medical gauze dipped in methyl ethyl ketone;

[0036] 3. Lamination: The foil and the ceramic substrate with a content of 98% aluminum oxide are passed through an epoxy adhesive at 180°C for 3h, 12kg / cm 2 glued together

[0037] 4. Coating: use a dropper to draw 1 ml of hexamethyldisilazane HMDS with a concentration of 30% and apply it on the substrate foil by spinning and spinning, dry and cool, and then spread the photoresist on it, evenly The speed time of the glue is 1...

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Abstract

The invention discloses a method for manufacturing a sheet-type alloy foil resistor, which belongs to the technical field of alloy foil resistors. The uniform hexamethyldisilazane process is used to improve the adhesion of the photoresist and effectively reduce the side engraving of the foil. Corrosion, using the aging process to improve reliability, so that the manufactured alloy foil resistance value has high precision, small temperature coefficient of resistance, within a wide range of temperature coefficient, automatic compensation of temperature coefficient is realized, the tracking temperature coefficient is extremely small, low noise, stable High performance, good high-frequency characteristics, fast response, small distribution parameters, can be used in precision measurement, digital-to-analog conversion, aviation and navigation inertial navigation systems, computer interface circuits and some systems with special requirements, suitable for large-scale promotion.

Description

technical field [0001] The invention belongs to the technical field of alloy foil resistors, and in particular relates to a manufacturing method of a chip-type alloy foil resistor. Background technique [0002] The main material foil of chip alloy foil resistor is finished and rolled by nickel-chromium alloy according to a certain proportion, and its thickness is less than 5μm. Compared with metal film resistor, it has a relatively good and complete crystal structure, so chip alloy Foil resistors have the advantages of small temperature coefficient of resistance, small size, low current noise, high precision, good stability, and high reliability, and are widely used in high-precision instruments, military weapon systems, and aerospace equipment. However, there are the following two defects in the existing processing and production process. One is that during the etching process, if the photoresist adhesion is not good, part of the edge photoresist will fall off and cause foi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/242H01C17/28H01C17/30
CPCH01C17/003H01C17/242H01C17/30H01C17/288
Inventor 李开锋李贵通黄明怀李福喜
Owner BDS ELECTRONICS
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