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PCB and laminating process thereof

A PCB board and process technology, applied in the field of PCB board and its lamination process, can solve the problems of inconvenient dust removal of printed circuit boards, inconvenience of scanning and inspection of printed circuit boards, and inconvenience of extrusion and bonding of printed circuit boards, etc. The effect of improving stability and improving the pass rate

Pending Publication Date: 2021-10-08
湖南维胜科技电路板有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] In view of the deficiencies in the prior art, the present invention provides a PCB board and its lamination process, which solves the problem that the internal and external structures of the existing PCB board and its lamination process proposed in the above-mentioned background technology are relatively simple, and cannot be used during use. It is better to scan and check the printed circuit board, but it is not convenient to remove dust from the printed circuit board. bond

Method used

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  • PCB and laminating process thereof
  • PCB and laminating process thereof
  • PCB and laminating process thereof

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0034] In the description of the present invention, unless otherwise stated, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer" , "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation should therefore not be construed as limiting ...

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Abstract

The invention discloses a PCB and a laminating process thereof, and relates to the technical field of PCBs and pressing thereof.The PCB comprises a supporting table and a lens, the left end and the right end of the upper portion of the supporting table are each provided with a fixing seat, a guide rod is installed on the lower portion of the inner side of each fixing seat, and a threaded rod and the guide rods are arranged in the lower end of a moving seat in a penetrating mode; a lower PCB is arranged at the right end above the moving seat, a top plate is arranged above the supporting table, the lens is located at the left end below the top plate, a dust removal mechanism is arranged on the right side of the lens, a gluing mechanism is arranged on the right side of the dust removal mechanism, and second hydraulic rods are installed at the front end and the rear end of the right side of the gluing mechanism correspondingly; and a third hydraulic rod is mounted at the lower end of the movable seat. The upper PCB and the lower PCB can be scanned and detected through the lens, dust and pollution particles on the surfaces of the upper PCB and the lower PCB can be cleaned through gas, and the upper PCB and the lower PCB can be pressed conveniently.

Description

technical field [0001] The invention relates to the technical field of PCB board and its lamination, in particular to a PCB board and its lamination process. Background technique [0002] PCB board, the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. PCB boards are widely used in the production process of electronic equipment . [0003] The internal and external structures of the existing PCB board and its pressing process are relatively simple, and the printed circuit board cannot be scanned and inspected during use, and it is not convenient to remove dust from the printed circuit board. The printed circuit board is glued and turned over, and it is not convenient to squeeze the printed circuit board to make it bond. Contents of the invention [0004] In view of the deficiencies in the prior art, the pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/4611H05K3/4638H05K3/0008H05K2203/163H05K2203/166H05K2203/1563
Inventor 黄光明吉建成唐川
Owner 湖南维胜科技电路板有限公司
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