Method for realizing interconnection between microwave signal boards and interconnected microwave signal boards
A technology of microwave signal and signal board, applied in the field of active phased array, can solve the problems of reliability and inability to meet the elastic expansion and contraction, and achieve the effect of compact structure
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[0039] There are following technical problems in the prior art:
[0040] 1. Long-distance signal vertical transmission and external vertical interconnection between boards of microwave signals;
[0041] 2. The problem of low torque plugging and unplugging of composite substrates;
[0042] 3. Disassembly and maintenance of the elastic mechanism;
[0043] 4. The problem of signal interconnection between composite substrates with excessive warpage.
[0044] In order to solve the above technical problems, this embodiment provides a method for interconnecting microwave signal boards, which specifically includes the following contents:
[0045] In this example, if figure 1 As shown, taking the adjacent composite substrate 1 and composite substrate 2 as an example, firstly, an interlayer adapter plate for supporting the composite substrate is arranged in the middle of the adjacent composite substrate 1 and composite substrate 2, and in the A limit hole for the limit spring connec...
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