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Soaking equipment and etching line film removing method

An equipment and water jet technology, applied in the field of immersion equipment and etching line film removal, can solve the problems of tight production capacity of printed circuit boards, scrapped printed circuit boards, and unclean film removal, so as to improve production yield and improve soaking. effect, the effect of ensuring production efficiency

Active Publication Date: 2021-10-01
WUXI SHENNAN CIRCUITS CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] During the production process of the printed circuit board, it is made through the processes of exposure, development, etching and film removal. As the complexity and difficulty of product introduction become higher and higher, the etched outer layer etching line after film removal , there will be unclean removal of the film, which will lead to serious scrapping of printed circuit boards, resulting in high cost and tight production capacity of printed circuit boards.

Method used

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  • Soaking equipment and etching line film removing method
  • Soaking equipment and etching line film removing method

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Embodiment Construction

[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0013] It should be noted that all directional indications such as up and down in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between the components in a certain posture as shown in the drawings. If the specific posture When a change occurs, the directional indication changes accordingly.

[0014] In addition, descriptions such as "first", "second" and so on in this appli...

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Abstract

The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to soaking equipment and an etching line film removing method. The soaking equipment comprises an upper water jet cutter, a lower water jet cutter, an object carrying conveying mechanism and a water disc, the object carrying conveying mechanism is used for carrying a to-be-soaked part between the upper water jet cutter and the lower water jet cutter and conveying the to-be-soaked part, and the upper water jet cutter and the lower water jet cutter are used for spraying a solution to the to-be-soaked part; and the water disc is arranged below the upper water jet cutter, the lower water jet cutter is arranged in a cavity formed by the water disc, the object carrying conveying mechanism carries the to-be-soaked part in the cavity formed by the water disc, and the water disc is used for containing a solution. According to the soaking equipment, the to-be-soaked part can be soaked in the solution, meanwhile, the solution has circulating fluidity, the soaking effect can be improved, the to-be-soaked part subjected to the soaking procedure does not affect streamline operation of overall manufacturing, the manufacturing efficiency is guaranteed, and the manufacturing yield of printed circuit boards and other products is increased.

Description

technical field [0001] The application belongs to the technical field of printed circuit board manufacturing, and in particular relates to a soaking device and a film removal method for etching lines. Background technique [0002] The output value of the global printed circuit board (PCB) industry accounts for more than a quarter of the total output value of the electronic component industry, and it is the industry with the largest proportion among various electronic component sub-sectors. Due to its unique position in the electronic basic industry, it has become the most active industry in the contemporary electronic component industry. [0003] During the production process of the printed circuit board, it is made through the processes of exposure, development, etching and film removal. As the complexity and difficulty of product introduction become higher and higher, the etched outer layer etching line after film removal , There will be dirty film removal, which will lea...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06
Inventor 张利华张冀仁杨之诚周进群缪桦由镭
Owner WUXI SHENNAN CIRCUITS CO LTD
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