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Flexible printed circuit (FPC) module with balanced deflection stress and electronic device

A technology of balance and stress, applied in the direction of electrical components, printed circuit components, circuits, etc., can solve problems such as poor reliability and stability, difficult development of deflection control, and different stresses, so as to weaken stress, reduce development difficulty, and ensure Effects on Reliability and Stability

Pending Publication Date: 2021-10-01
BEIJING DREAM INK TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an object of the present invention is to propose an FPC module with balanced deflection stress to solve the problem that the stress in each direction of the FPC in the process of coordinating deflection is different in the current technology, resulting in difficulty in the development of deflection control, reliability and stability. poor problem

Method used

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  • Flexible printed circuit (FPC) module with balanced deflection stress and electronic device
  • Flexible printed circuit (FPC) module with balanced deflection stress and electronic device
  • Flexible printed circuit (FPC) module with balanced deflection stress and electronic device

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Embodiment Construction

[0024] The following description and drawings illustrate specific embodiments of the invention sufficiently to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present invention includes the full scope of the claims, and all available equivalents of the claims. These embodiments of the present invention may be referred to herein, individually or collectively, by the term "invention", which is for convenience only and is not intended to automatically limit the application if in fact more than one invention is disclosed The scope is any individual invention or inventive concept.

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Abstract

The invention discloses an FPC module with balanced deflection stress and an electronic device, and relates to the technical field of electronic circuits. The FPC module comprises a first terminal on which a first circuit is distributed, a second terminal on which a second circuit is distributed, and at least three bridging units connected with the first wiring terminal and the second wiring terminal and arranged side by side; a third circuit is distributed on the bridging units, and the first circuit and the second circuit are connected through the third circuit; and the at least three bridging units are used for forming a polygonal three-dimensional supporting structure through reverse bending and staggering. The FPC is designed to be provided with a plurality of bridging units which can form the three-dimensional supporting structure in a staggered mode, the center of the supporting point is located in the center of the three-dimensional supporting structure, balance of deflection stress of the FPC in all directions is facilitated, the stress of the FPC is weakened to a certain degree, the development difficulty of deflection control can be reduced, the linear relation between the deflection degree and the control parameters is improved, and the reliability and stability of FPC deflection control are ensured.

Description

technical field [0001] The invention belongs to the technical field of electronic circuits, in particular to an FPC module and an electronic device for balancing deflection stress. Background technique [0002] FPC (Flexible Printed Circuit board, flexible printed circuit board), also known as flexible circuit board, which is made of a series of film materials such as polyimide or polyester film, has high reliability and is absolutely The best flexible printed circuit board, referred to as soft board or FPC, has the characteristics of high wiring density, light weight, and thin thickness. It is widely used in many fields such as automotive electronics, consumer electronics, home appliances, and industrial equipment. [0003] In order to meet the development needs of miniaturization and miniaturization of electronic devices, the demand for FPC flexible circuit boards is no longer limited to bending resistance, but needs to be coordinated to meet more precise control. For exa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01R31/06
CPCH05K1/028H01R31/06H05K2201/057
Inventor 于洋
Owner BEIJING DREAM INK TECH CO LTD
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