Control method of semiconductor packaging control system

A technology of control system and control method, applied in the direction of control system, vector control system, control electromechanical brake, etc., to achieve the effect of ensuring performance and improving suppression ability

Active Publication Date: 2021-10-01
东莞普莱信智能技术有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the technical problems of linear motor control based on these two methods

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Control method of semiconductor packaging control system
  • Control method of semiconductor packaging control system
  • Control method of semiconductor packaging control system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0261] According to a specific embodiment of the present invention, the steps of establishing a transfer function adding a dedicated disturbance observer in the control method of the semiconductor packaging control system of the present invention will be described in detail.

[0262] According to a specific embodiment of the present invention, establishing the transfer function of adding a dedicated interference observer specifically includes the following steps:

[0263] According to the principle of the interference observer, the establishment of the interference observer includes the following steps:

[0264] Set u as the reference input of the basic model with disturbance observer, and its value is the obtained velocity acceleration look-ahead K af the s 2 、K vf the s 2 and position loop control output G PID sum of (s);

[0265]Let d be the low-frequency interference of the system, ξ be the high-frequency interference of the system, Q(s) be the filter, G V (s) is the...

Embodiment 2

[0284] According to a specific embodiment of the present invention, the steps of establishing a solidified control kernel function based on the linear motor mathematical model, current loop and speed loop in the control method of the semiconductor packaging control system of the present invention will be described in detail.

[0285] Based on the linear motor mathematical model, current loop and speed loop, the solidified control kernel function G is established V (s) specifically include the following steps:

[0286] Establish the mathematical model of the linear motor platform in the control system, the formula is as follows:

[0287]

[0288] in,

[0289] G M The output of the linear motor platform in the control system;

[0290] L is the armature inductance of the linear motor (unit: mH);

[0291] R is the linear motor armature resistance (unit: Ω);

[0292] K f is the force constant of the linear motor (unit: N / A);

[0293] m is the moving mass of the linear mot...

Embodiment 3

[0325] According to a specific embodiment of the present invention, in the control method of the semiconductor encapsulation control system of the present invention, based on curing control kernel function G V (s), the steps of establishing the transfer function of the position loop using PID control are described in detail.

[0326] Based on the solidified control kernel function G V (s), establish the position loop transfer function that adopts PID control, specifically comprise the following steps:

[0327] The PID control expression of the position loop is:

[0328]

[0329] Establish the transfer function G of the position loop controlled by PID PID (S) is:

[0330]

[0331] in,

[0332] K pp is the proportional coefficient of the position ring;

[0333] K pi is the integral coefficient of the position loop;

[0334] K pd is the differential coefficient of the position loop;

[0335] G p Output for the position loop;

[0336] D. 4 =K pp B 2 ;

[0337...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a control method of a semiconductor packaging control system, which belongs to the technical field of semiconductors. Firstly, a position loop, a speed loop and a current loop are controlled based on PID / PI / PI, on the basis, a control object, the current loop and the speed loop serve as a control whole, acceleration and speed feedforward are added to the position loop to improve the system response capacity and guarantee the target tracking characteristic performance, meanwhile, a specific disturbance observer is also added to the position loop, the suppression capability of internal interference and external interference is improved, and the performance of external interference suppression characteristics is realized.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a control method for a semiconductor packaging control system. Background technique [0002] In the manufacture of integrated circuits, miniaturized, multi-pin, and fine-pitch chips have extremely high requirements on the servo performance, positioning accuracy, and positioning time of the motion control system of packaging equipment. Run smoothly and accurately to a given target position. However, in the process of high-speed and high-precision point-to-point motion with fast start and stop, external disturbances, mechanical resonance and nonlinear factors of the control system itself all affect the servo performance of the system to varying degrees, directly affecting the positioning of the packaging equipment control system Accuracy and positioning time, so the system servo control strategy is the core difficulty of the chip packaging control system. [0003] In the C...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H02P21/13H02P23/12H02P6/00H02P7/02H02P25/06
CPCH02P21/13H02P23/12H02P6/006H02P7/02H02P25/06
Inventor 田兴银张勇毛军
Owner 东莞普莱信智能技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap