MEMS device and manufacturing method thereof

A manufacturing method and device technology, applied in the manufacture of microstructure devices, semiconductor/solid-state device components, piezoelectric/electrostrictive/magnetostrictive devices, etc. question

Pending Publication Date: 2021-10-01
MEMSENSING MICROSYST SUZHOU CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Microphone products may be dropped, impacted or subjected to a large voltage during daily use, which will cause a large deformation of the diaphragm of the microphone. If there is no anti-adhesive structure, the diaphragm and the back plate layer will be under the action of surface adhesion. Continue to pull in, if there is no external force, the diaphragm and the back plate will not be separated, resulting in product failure. This failure is also common after the release process of the microphone chip

Method used

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  • MEMS device and manufacturing method thereof
  • MEMS device and manufacturing method thereof
  • MEMS device and manufacturing method thereof

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Embodiment Construction

[0032] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown. For the sake of simplicity, the semiconductor structure obtained after several steps can be described in one figure.

[0033] It should be understood that when describing the structure of a device, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean being directly on another layer or another region, or Other layers or regions are also included between it and another layer or another region. Also, if the device is turned over, the layer, one region, will be "below" or "beneath" the other layer, or region.

[0034] If it is to describe the situation directly on another layer or anothe...

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Abstract

The invention discloses an MEMS device and a manufacturing method thereof. The method comprises the following steps: forming a first functional layer; forming a first sacrificial layer on the first functional layer; forming a through hole in the first sacrificial layer, wherein the through hole penetrates through the first sacrificial layer; forming a second sacrificial layer on the first sacrificial layer, wherein a groove is formed in the second sacrificial layer; forming a second sacrificial layer on the first sacrificial layer, and forming a second functional layer on the second sacrificial layer, wherein, grooves in the second sacrificial layer are filled with the second functional layer to form an anti-sticking structure, the first sacrificial layer is made of a low-density silicon oxide material, and the second sacrificial layer is made of a high-density silicon oxide material. According to the manufacturing method of the MEMS device, an anti-sticking structure is formed on the surface of one side, close to a cavity, of a vibrating diaphragm or a back polar plate. The anti-sticking structure is formed by two sacrificial layers and has a smoother morphology. In addition, when the vibrating diaphragm is greatly deformed, the stress concentration of the vibrating diaphragm is reduced, so that the failure of the MEMS device and the cost of the product are reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor device manufacturing, in particular to a MEMS device and a manufacturing method thereof. Background technique [0002] With the maturity of MEMS device application and technology, the market puts forward higher requirements for the reliability and sensitivity of MEMS devices. For a condenser microphone, its structure is mainly composed of a back plate and a diaphragm, and a sound signal is detected by measuring capacitance changes through a circuit. Microphone products may be dropped, impacted or subjected to a large voltage during daily use, which will cause a large deformation of the diaphragm of the microphone. If there is no anti-adhesive structure, the diaphragm and the back plate layer will be under the action of surface adhesion. Continue to pull in, if there is no external force, the diaphragm and the back plate will not be able to separate, resulting in product failure. This failur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81C1/00158B81B2201/0257
Inventor 孟燕子荣根兰孙恺胡维
Owner MEMSENSING MICROSYST SUZHOU CHINA
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