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Sample container and thermal analyzer

A technology of thermal analysis device and sample container, which is applied in thermal analysis of materials, containers, and analysis materials, etc., can solve problems such as movement, inability to observe samples, and hindrance to the observation of sample color and structure, so as to reduce thermal deformation, The effect of high-precision physical property evaluation

Pending Publication Date: 2021-09-28
HITACHI HIGH TECH SCI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In a film-like sample such as a polymer film or paper, thermal deformation such as shrinkage and warpage may occur when heated, and there is a problem that this thermal deformation cannot be reduced in conventional open-type sample containers. The sample cannot be observed in the sealed sample container
[0009] In addition, in the prior art thermal analysis device for observing a sample container, there is a problem that when thermal deformation occurs during heating or cooling, reflection of reflected light or angle deviation due to change in inclination of the sample surface occurs. changes, which hinder the observation of the color tone and structure of the sample, and the position of the sample being observed is shifted, therefore, the area of ​​the sample being analyzed changes.

Method used

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  • Sample container and thermal analyzer
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  • Sample container and thermal analyzer

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Embodiment Construction

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 It is a sectional view showing the structure of the thermal analysis device according to the embodiment of the present invention.

[0035] The thermal analysis device 1 is a differential scanning calorimeter (DSC), and has the same structure as a conventional differential scanning calorimeter except that a window 11W for observing the inside is provided on the cover 11 of the heating furnace 10. illustrate.

[0036] The thermal analysis device 1 has a measurement sample container 2 for accommodating a measurement sample S, a reference substance container 3 for accommodating a reference substance R, a heating furnace 10, and is connected between the measurement sample container 2 and the reference substance container 3 and the heating furnace 10. A thermal resistor 4 forming a thermal flow path between them, a thermocouple 7 on the measurement sample side, a ther...

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Abstract

Provided is a sample container and a thermal analyzer. The thermal analyzer allows reliable observation of a film-like sample by solving a problem in that the film-like sample undergoes thermal deformation such as shrinkage or warping when the sample is heated or cooled. Further disclosed is a sample container for a thermal analyzer that is used to measure thermal behaviors of a sample attributable to heating or cooling of the sample and to observe the sample. The container includes a main body having a cylinder-shaped bottom and an open cylinder-shaped top and a transparent or translucent pressure plate that is in contact with an inner surface of the opening of the main body and presses down at least the pressure plate placed on a sample placed on the bottom surface of the main body.

Description

technical field [0001] The present invention relates to a sample container for performing physical thermal analysis of a sample while heating or cooling, and a thermal analysis device using the sample container. Background technique [0002] Conventionally, as a method of evaluating the temperature characteristics of a sample, a method called thermal analysis in which a sample is heated or cooled and a physical change of the sample accompanied by a temperature change is measured is performed. Thermal analysis is defined in JIS K0129:2005 "General Principles of Thermal Analysis", and thermal analysis is a method for measuring the physical properties of a sample when the temperature of the measurement object (sample) is controlled by a program. Generally used thermal analysis has the following five methods: (1) differential thermal analysis (DTA) for detecting temperature (temperature difference), (2) differential scanning calorimetry (DSC) for detecting heat flow difference, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/00G01N21/84B65D81/34B65D25/02
CPCG01N25/00G01N21/84B65D25/02B65D81/343G01K17/00G01N5/04G01N25/20
Inventor 山崎绿平西村晋哉
Owner HITACHI HIGH TECH SCI CORP
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