Large-size chip, manufacturing method thereof and large-size chip wafer

Abstract

The invention provides a large-size chip, a manufacturing method thereof and a large-size chip wafer. The manufacturing method comprises the steps that a wafer is provided, the wafer comprises a plurality of large-size chips, and the size of each large-size chip is larger than the maximum exposure view field of a photoetching machine; the large-size chip comprises at least two splicing chips; each splicing chip comprises a substrate and a first metal layer, and the first metal layer at least comprises a to-be-interconnected metal layer used for interconnection between different splicing chips; and a second metal layer is formed, the second metal layer at least comprises an inter-chip interconnection metal layer, and the inter-chip interconnection metal layer spans the virtual scribing area between the adjacent splicing chips and is electrically connected with the respective metal layers to be interconnected of the adjacent splicing chips. According to the invention, interconnection between different splicing chips is realized on a large-size chip, and electric signal interconnection optimization of a large-size chip level is realized through interconnection function expansion of small splicing chips, so that integration of more functions is realized, and flexibility and compatibility are realized.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a large-size chip, a manufacturing method thereof, and a large-size chip wafer. Background technique [0002] In traditional lithography, the size of a single chip is smaller than or equal to the maximum exposure field of view of the lithography machine, and a single exposure completes the lithography of a single chip. With the development of semiconductor technology, chips play a wider role in various fields. In some fields, large-scale chips (such as high-speed computing chips) are required, and the size of these large-scale chips has exceeded the maximum size of the lithography machine. Exposure field of view (for example, 26mm×33mm), so in the manufacturing process, stitching technology needs to be used. As the name implies, in the chip manufacturing process, one splicing chip is formed by one exposure, multiple splicing chips are formed ...

AI Technical Summary

Problems solved by technology

[0003]In actual application, the functional integration between the small splicing chips on the large size chip needs to be improved

Images