High-power semiconductor device with heat dissipation function

Abstract

The invention discloses a high-power semiconductor device with a heat dissipation function. The high-power semiconductor device structurally comprises a circuit board, a regulator, a heat dissipation sheet and a heat dissipation body, wherein the heat dissipation sheet is arranged at the bottom of the heat dissipation body and movably connected with the heat dissipation body, the circuit board is arranged on the regulator, the circuit board is in clearance fit with the regulator, the regulator is provided with a heat conduction pad, an operator, a mounting seat, a pin, a fastener and a semiconductor, the semiconductor is provided with the pin, the pin is connected with the semiconductor, and the fastener is arranged in the center of the operator. According to the invention, a supporting device is supported between an insulating pressing plate and a heat conduction pad so as to add the pressing supporting body of the insulating pressing plate and an electric heating plate, so that the insulating pressing plate and the heat conduction pad are connected more stably; and an attaching device on the supporting device can be further buckled on the heat conduction pad in an abutting mode, so that when the device is assembled, the insulating pressing plate and the heat conduction pad can be pressed more tightly in an attaching mode.

Description

technical field [0001] The invention relates to the field of high-power semiconductor devices, in particular to a high-power semiconductor device with heat dissipation. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical characteristics of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. Power semiconductor devices usually have heat sinks; [0003] High-power semiconductor devices with heat dissipation usually only have fixing holes at the center of the insulating plate, which reduces the compression support structure between the insulating plate and the thermal pad to a certain extent, and the device is mounted on the insulating plate. During the welding between the welding, the welding pressure acts on the insulating pressing plate, and the ins...

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Problems solved by technology

[0003] High-power semiconductor devices with heat dissipation usually only have fixing holes at the center of the insulating plate, which reduces the compression support structure between the insulating plate and the thermal pad to a certain extent, and the device is installed on the insulating plate. During the welding between the welding, the welding pressure acts on the insulating pressing plate, and the insulating pressing plate will break if the pressure is too high

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