Chip processing table for high-light-efficiency low-thermal-resistance high-power LED outdoor lamp

Abstract

The invention relates to a chip processing table for a high-light-efficiency low-thermal-resistance high-power LED outdoor lamp. The chip processing table comprises a workbench, a welding base arranged on the workbench, and a moving plate which is arranged over the welding base in an up-down moving mode and forms a chip clamping station with the welding base. The chip processing table further comprises a storage bin and a feeding device, wherein the storage bin is located below the welding base and used for storing tin; the feeding device comprises a feeding channel penetrating through the welding base and extending downwards into the storage bin, a pumping assembly arranged in the feeding channel and capable of pumping tin in the storage bin into the feeding channel, and a feeding assembly installed on the pumping assembly and capable of feeding tin in the feeding channel to a chip welding spot; and the feeding assembly comprises a containing bowl used for containing tin, a stirring mechanism rotationally installed in the containing bowl, and a feeding mechanism arranged in the stirring mechanism and capable of conveying scaling powder into the containing bowl. The technical problem that in the prior art, tin is not prone to being attached to a welding spot, and consequently the welding quality is reduced is solved.

Description

technical field [0001] The invention relates to LED chip processing equipment, in particular to a chip processing table for LED outdoor lamps with high light efficiency, low thermal resistance and high power. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) has the advantages of energy saving, high efficiency, long life, etc., so it will become the development trend of the future lighting field. When LED works, only about 30-40% of the input electrical energy is finally converted into light energy, and the rest 60-70% of the energy is mainly converted into heat energy in the form of lattice vibration that occurs by non-radiative recombination. The lasing efficiency decreases; when the temperature exceeds a certain value, the device failure rate increases exponentially. Statistics show that the reliability decreases by 10% for every 2 °C increase in the component temperature. Generally speaking, whether the LED lamp works stably and has good qual...

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Problems solved by technology

[0005] In view of the above problems, the present invention provides a high-efficiency, low-thermal-resistance, high-power LED outdoor lamp chip processing table for LED lamps, which sends the tin pumped by the pumping assembly into the material delivery channel to the solder joint of the chip through the holding bowl. In addition, during the process of feeding tin from the material bowl, the flux enters the material bowl through the feeding mechanism, and the flux is stirred evenly with the tin under the action of the stirring mechanism, so that the tin can be quickly attached to the solder joints, which solves the problem of the prior art. The technical problem that solder joints are not easy to adhere to tin leads to the decline of soldering quality

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