QSFP28 module

A technology of sub-module and optical receiving sub-module, which is applied in the field of optical communication, can solve the problem of high cost, and achieve the effect of reducing electromagnetic interference and improving EMI performance.

Inactive Publication Date: 2021-09-03
武汉永鼎光通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This design requires separate assembly and is more expensive

Method used

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Examples

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Embodiment Construction

[0038] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0039] This embodiment provides a QSFP28 module, such as Figure 1~2 As shown in the overall structure diagram of , it includes an upper cover 3 and a base 1 fixedly connected to form an accommodating space, and a photoelectric sub-module 2 is arranged in the accommodating space, and the port of the photoelectric sub-module 2 extends out of the accommodating space , the accommodating space is also provided with conductive glue 4, such as Figure 9 and Figure 11 As shown, the conductive glue 4 closes the connection gap between the upper cover 3 and the base 1 and the connection gap between the upper cover 3 , the base 1 and the ports of the photoelectric sub-module 2 .

[0040] Since the upper cover 3 and the base...

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Abstract

The invention relates to a QSFP28 module which comprises an upper cover and a base which are fixedly connected to form a containing space, a photoelectric sub-module is arranged in the containing space, a port of the photoelectric sub-module extends out of the containing space, and conductive adhesive is further arranged in the containing space, and the conductive adhesive seals a connecting gap between the upper cover and the base and connecting gaps among the upper cover, the base and the port of the photoelectric sub-module. A conductive adhesive is dispensed at the seam of the upper cover and the base to block the connection gap between the upper cover and the base, and a conductive adhesive is dispensed at the port of the photoelectric sub-module and the connection gap between the upper cover and the base to block the connection gap between the port of the photoelectric sub-module and the connection gap between the upper cover and the base; the upper cover, the base and the conductive adhesive are matched with each other, so that the accommodating space forms a closed shielding space, electromagnetic signals are prevented from leaking from each connecting gap of the accommodating space, electromagnetic interference to external equipment is prevented, and the EMI performance of the QSFP28 module is improved.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a QSFP28 module. Background technique [0002] The QSFP28 optical module belongs to the mainstream 100G optical module in the market. The QSFP28 optical module provides four channels of different signals, and the transmission rate supports 25Gbps, and the maximum may reach 40Gbps. The size of the QSFP28 optical module is smaller than other 100G modules, so it has received more and more attention. [0003] At present, customers in the industry have high requirements on the EMI (Electromagnetic Interference, electromagnetic interference) performance of the QSFP28 module, which requires electromagnetic shielding design inside the module. The current electromagnetic shielding design generally uses a separate conductive or wave-absorbing material to mount inside the module. This design requires separate assembly and is expensive. Contents of the invention [0004] ...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4287G02B6/4277G02B6/428G02B6/4239
Inventor 程立本代晓光田军
Owner 武汉永鼎光通科技有限公司
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