Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Saw chain guide double-sided continuous polishing production equipment

A technology for production equipment and guide plates, which is applied in the field of double-sided continuous polishing production equipment for saw chain guide plates, can solve problems such as potential safety hazards, easy sparks, and dust hazards, and achieve the goals of eliminating potential safety hazards, reducing labor intensity, and improving feeding efficiency. Effect

Active Publication Date: 2022-06-07
浙江辉煌三联实业股份有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the A-side and B-side are usually polished separately on different machines. After the A-side polishing machine completes the A-side polishing, it needs to be transferred to the B-side polishing machine for B-side polishing again, and the surface is manually turned over during the transfer process. less efficient
[0003] In addition, the traditional abrasive belt polishing method is used to polish the A side and the B side, which will cause dust hazards and sparks easily, posing safety hazards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Saw chain guide double-sided continuous polishing production equipment
  • Saw chain guide double-sided continuous polishing production equipment
  • Saw chain guide double-sided continuous polishing production equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0047] As an embodiment, the magnetic adsorption device includes a magnetic suction cup 23 disposed on the back of the flip plate 22 and a suction cup cylinder 232 for driving the magnetic suction cup 23 to be close to or away from the flip plate 22 . The magnetic suction cup 23 is mounted on a suction cup support 231 , the suction cup support 231 is hinged to the flap 22 , and the suction cup cylinder 232 drives the suction cup support 231 to rotate.

[0048] Specifically, the suction cup bracket 231 includes two tripods arranged correspondingly on the left and right sides, the flip plate 22 is fixed on the bottom edge of the tripod, the suction cup cylinder 232 is hinged with the top corner of the tripod, and the bottom corner of the tripod is connected with the flip plate 22 Hinged, the left and right sides of the back of the flap are correspondingly provided with hinge blocks hinged with the flap 22 .

[0049] Of course, it can be understood that the magnetic adsorption de...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a saw chain guide plate double-sided continuous polishing production equipment, which includes an automatic feeder, an A-side polishing machine, an automatic turning machine, a B-side polisher, and a cleaning machine. The automatic feeder transports the saw chain guide plate to the A-side Polishing machine, the A side polishing machine grinds the A side of the saw chain guide plate, the automatic turning machine turns over the saw chain guide plate and then transports it to the B side polishing machine, and the B side polishing machine grinds the B side of the saw chain guide plate Grinding is carried out, and the cleaning machine cleans the polished saw chain guide plate, and the surface A polishing machine and the surface B polishing machine adopt water grinding polishing. The invention can realize automatic material feeding and automatic flipping, so that the saw chain guide plate can complete continuous surface A polishing, surface B polishing and water washing, and the efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of saw chain processing, in particular to a double-sided continuous polishing production equipment for a saw chain guide plate. Background technique [0002] Both sides of the chain guide, A and B, need to be polished. At present, side A and side B are usually polished separately on different machines. After the polishing machine on side A finishes polishing side A, it needs to be transferred to side B polishing machine for side B polishing again, and the side is turned manually during the transfer process. less efficient. [0003] In addition, the traditional use of abrasive belt polishing to polish the A and B surfaces will cause dust hazards, and it is easy to generate sparks, which is a potential safety hazard. SUMMARY OF THE INVENTION [0004] In view of the defects of the prior art, the technical problem to be solved by the present invention is to provide a double-sided continuous polishing product...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/00B24B29/02B24B41/00B24B49/00B24B55/06
CPCB24B27/0023B24B29/02B24B41/005B24B49/00B24B55/06Y02P70/10
Inventor 赵志火马靖
Owner 浙江辉煌三联实业股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com