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Thermal management method of IGBT module and storage medium

A technology of thermal management and modeling, applied in the thermal management method of IGBT modules and the field of storage media, can solve problems such as inability to achieve adjustment effects, and achieve the effects of prolonging life, improving effects, and improving reliability

Pending Publication Date: 2021-08-10
HOHAI UNIV
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Problems solved by technology

On the other hand, although some methods have realized the management of junction temperature fluctuations to a certain extent, they still focus on the adjustment of fundamental frequency junction temperature fluctuations, and cannot achieve good adjustments for some cases where low-frequency junction temperature fluctuations account for a relatively high proportion. Effect

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  • Thermal management method of IGBT module and storage medium
  • Thermal management method of IGBT module and storage medium
  • Thermal management method of IGBT module and storage medium

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Embodiment Construction

[0032] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings.

[0033] refer to figure 1 , according to the thermal management method of the IGBT module of the embodiment of the present invention, specifically includes the following steps:

[0034] S100: Obtain the fundamental frequency junction temperature data of the IGBT module according to the wind speed and temperature data of at least one whole year and the power loss model of the IGBT module;

[0035] S200: Using the cycle counting method to extract the low-frequency junction temperature data from the fundamental frequency junction temperature data, using the IGBT life model and the linear cumulative damage rule to calculate the low-frequency life consumption and the fundamental frequency life consumption of the IGBT module;

[0036] S300: Select the type of junction temperature fluctuation that has a higher proportion of low-frequency life consump...

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Abstract

The invention discloses a thermal management method of an IGBT module and a storage medium, and the method comprises the following steps: S100, obtaining the fundamental frequency junction temperature data of the IGBT module according to the wind speed and air temperature data of at least one year and a power loss model of the IGBT module; s200, extracting low-frequency junction temperature data from the fundamental frequency junction temperature data by adopting a cycle counting method, and calculating low-frequency life consumption and fundamental frequency life consumption of the IGBT module by utilizing an IGBT life model and a linear cumulative damage rule; s300, selecting a junction temperature fluctuation type with a higher proportion in the low-frequency life consumption and the fundamental-frequency life consumption as an emphatically suppressed junction temperature fluctuation type, and quantitatively analyzing a distribution rule of the life consumption with the higher proportion, thereby determining a target junction temperature fluctuation amplitude; s400, calculating the junction temperature threshold value of the junction temperature fluctuation type needing to be suppressed, the corresponding electrical parameter value and the thermal management working interval, and adjusting the electrical parameter to control the junction temperature of the IGBT module not to exceed the junction temperature threshold value. According to the thermal management method of the technical scheme, the effectiveness of thermal management can be improved, and the service life of the IGBT module is prolonged.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a heat management method and a storage medium of an IGBT module. Background technique [0002] This year, the installed capacity of wind power generation systems has achieved a leap-forward growth, and power converters have been widely used. As the core component of converter energy conversion and control, the service life of IGBT modules is closely related to system reliability. Taking the wind power converter as an example, due to the fluctuation and intermittency of the power of the wind power converter, the IGBT module is subjected to the impact of thermal load for a long time, and thermal fatigue aging is prone to occur during operation, which reduces its reliability. [0003] Existing research is usually based on real-time temperature feedback to smooth the junction temperature of the IGBT module, resulting in a long regulation period and complex controller struc...

Claims

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Application Information

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IPC IPC(8): G06F30/20G06Q50/06G06F119/02G06F119/04G06F119/06G06F119/08
CPCG06F30/20G06Q50/06G06F2119/08G06F2119/06G06F2119/04G06F2119/02
Inventor 张军胡欣悦缪可妍黄熠桢蒋雨楠周胜鹏
Owner HOHAI UNIV
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