Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board grinding production system

A production system and circuit board technology, applied in the direction of grinding machines, printed circuit, printed circuit manufacturing, etc., can solve the problems of inability to clean the board surface, inconvenient use, and inability to adjust the grinding position, so as to achieve the effect of improving the effect and improving work efficiency

Pending Publication Date: 2017-09-19
信丰迅捷兴电路科技有限公司
View PDF9 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The circuit board grinding machine in the production technology of general circuit boards usually only uses the pinch roller and the grinding plate roller for grinding, and the grinding position cannot be adjusted. It is not suitable for irregularly shaped circuit boards, and the grinding effect needs to be improved; , the circuit board grinding machine in the prior art cannot clean the polished board surface, which is inconvenient to use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board grinding production system
  • Circuit board grinding production system
  • Circuit board grinding production system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] refer to Figure 1 to Figure 6 , a circuit board grinding plate production system, comprising a grinding plate frame 1, a plate feeding mechanism 2, a grinding head position adjustment mechanism 3, a polishing mechanism 4, a cleaning mechanism 5 and a drying mechanism 6, the grinding plate frame includes a support side Plate 101, the plate feeding mechanism is arranged between the supporting side plates 101 of the grinding plate frame;

[0037] The position adjustment mechanism of the grinding head includes an X-direction movement assembly, a Y-direction movement assembly and a Z-direction movement assembly. On the X-direction motion assembly, the Y-direction motion assembly includes a Z-direction motion base 305, the Z-direction motion assembly includes a Z-direction motion motor 308, and a Z-direction lifting rod 309 connected to the Z-direction motion motor 308 through a coupling , the Z-direction movement motor 308 is fixedly arranged on the top edge of the Z-direc...

Embodiment 2

[0042] refer to Figure 1 to Figure 6 , a circuit board grinding plate production system, comprising a grinding plate frame 1, a plate feeding mechanism 2, a grinding head position adjustment mechanism 3, a polishing mechanism 4, a cleaning mechanism 5 and a drying mechanism 6, the grinding plate frame includes a support side Plate 101, the plate feeding mechanism is arranged between the supporting side plates 101 of the grinding plate frame;

[0043] The position adjustment mechanism of the grinding head includes an X-direction movement assembly, a Y-direction movement assembly and a Z-direction movement assembly. On the X-direction motion assembly, the Y-direction motion assembly includes a Z-direction motion base 305, the Z-direction motion assembly includes a Z-direction motion motor 308, and a Z-direction lifting rod 309 connected to the Z-direction motion motor 308 through a coupling , the Z-direction movement motor 308 is fixedly arranged on the top edge of the Z-direc...

Embodiment 3

[0050] In this embodiment, a laser sensor and sandpaper are added on the basis of the second embodiment.

[0051] join figure 1 , a laser sensor 7 is arranged at the opposite position on the top edge of the support side plate 101 on both sides of the grinding plate frame, the optical sensor is located at the position of the grinding head position adjustment mechanism 3, and the laser sensor 7 is connected to the conveying motor 202. A laser sensor 7 is added, and when the circuit board to be polished moves to a set position, the conveying motor 202 is controlled to stop moving, which is convenient for the stable grinding work of the polishing mechanism 4 on the circuit board.

[0052] In this preferred embodiment, sandpaper (not shown in the figure) is pasted on the grinding roller 401 . By adopting the above technical scheme, by using the pasted sandpaper, it is easy to replace and the portability of the equipment is improved.

[0053] The circuit board grinding plate prod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a circuit board grinding production system. The circuit board grinding production system comprises a board grinding rack, a board conveying mechanism, a grinding head position adjusting mechanism, a grinding mechanism, a cleaning mechanism and a drying mechanism. The board conveying mechanism is arranged between supporting side plates of the board grinding rack. The grinding head position adjusting mechanism comprises an X-direction movement assembly, a Y-direction movement assembly and a Z-direction movement assembly. The grinding mechanism comprises a grinding roller, a grinding fixing plate and a grinding motor. The cleaning mechanism and the drying mechanism are both arranged in the positions, between the supporting side plates and close to the grinding head position adjusting mechanism part, of the board grinding rack. The circuit board grinding production system is suitable for circuit boards in various shapes, the grinding position can be adjusted, the grinding pressure can be controlled, and the grinding effect is improved. In addition, by additionally arranging the cleaning mechanism and the drying mechanism, the ground circuit boards can be cleaned, and the working efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and more specifically relates to a circuit board grinding process, in particular to a circuit board grinding production system. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components , PCB boards are widely used in electronic technology. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical interconnection between them. . According to the number of layers, circuit boards are divided into three major categor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B9/04B24B49/16B24B49/12B24B41/00B24B55/00B24B47/04H05K3/00B08B3/02F26B21/00
CPCH05K3/0044F26B21/004B08B3/02B24B9/04B24B41/005B24B47/04B24B49/12B24B49/16B24B55/00
Inventor 杜林峰谢和全李志胜
Owner 信丰迅捷兴电路科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products