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Flame-retardant polyarylether-based composition as well as prepreg and thermosetting high-frequency copper-clad plate prepared from flame-retardant polyarylether-based composition

A polyarylene ether, flame retardant technology, applied in the field of prepreg and thermosetting high-frequency copper clad laminate, can solve the problems of poor flame retardant performance of copper clad laminate, large dielectric loss factor, affecting the overall use, etc., and achieve flame retardant performance. Prominent, strong resin adhesion, smooth surface effect

Active Publication Date: 2021-08-06
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the high-frequency copper-clad laminate in this invention patent uses epoxy resin as the main resin, and lacks flame-retardant treatment, so the final copper-clad laminate will have: first, the dielectric loss factor is large, and the overall dielectric The performance is poor; second, the flame retardant performance of the copper clad laminate is poor, which affects the two problems of the overall use

Method used

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  • Flame-retardant polyarylether-based composition as well as prepreg and thermosetting high-frequency copper-clad plate prepared from flame-retardant polyarylether-based composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0094] Take 450 parts of polyphenylene ether (Mn=23000) and dissolve it in toluene to form a 20wt / v% solution, then add 5 parts of 4,4'-biphenol, 20 parts of 1,1,2,2-tetra(4 -Hydroxyphenyl)ethane, 20 parts of bromide of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide and 55 parts of 9, The bromide of 10-dihydro-9-oxa-10 phosphaphenanthrene-10-oxide and rosebic acid adduct, after fully stirring and mixing, slowly add 50 parts of dibenzoyl peroxide in batches, The reaction was carried out for 8 hours under the condition that the temperature of the system was controlled at 100°C.

[0095] Then, add a small amount of methanol to the system, stir slowly to mix evenly, and let it stand overnight at room temperature, and then filter to remove the high molecular weight polyphenylene ether chains that cannot fully undergo the chain redistribution reaction; then, add a large amount of Methanol was stirred vigorously to fully separate the hydroxyl-terminated poly...

Synthetic example 2

[0097]Take 380 parts of polyphenylene ether (Mn=19000) and dissolve it in toluene to form a 25wt / v% solution, then add 15 parts of tetrabromobisphenol A, 10 parts of 1,1,2,2-tetrakis(4-hydroxy Phenyl)ethane, 15 parts of bromide of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide and 60 parts of 9,10- The bromide of dihydro-9-oxa-10phosphaphenanthrene-10-oxide and rosenic acid adduct, after fully stirring and mixing, slowly add 32 parts of dibenzoyl peroxide in batches, in the control system The reaction was carried out for 24 hours at a temperature of 90°C.

[0098] Then, add a small amount of methanol to the system, stir slowly to mix evenly, and let it stand overnight at room temperature, and then filter to remove the high molecular weight polyphenylene ether chains that cannot fully undergo the chain redistribution reaction; then, add a large amount of Methanol was stirred vigorously to fully separate the hydroxyl-terminated polyphenylene ether oligo...

Synthetic example 3

[0100] Take 400 parts of polyphenylene ether (Mn=35000) and dissolve it in toluene to form a 14.5wt / v% solution, then add 6 parts of tetrabromobisphenol A, 4 parts of 1,1,2,2-tetra(4- hydroxyphenyl)ethane, 25 parts of bromide of 10-(2,5-dihydroxyphenyl)-10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide and 65 parts of 9,10 -The bromide of dihydro-9-oxa-10 phosphaphenanthrene-10-oxide and rosenic acid adduct, after fully stirring and mixing, slowly add 35 parts of dibenzoyl peroxide step by step, under control The reaction was carried out for 6 hours at a system temperature of 105°C.

[0101] Then, add a small amount of methanol to the system, stir slowly to mix evenly, and let it stand overnight at room temperature, and then filter to remove the high molecular weight polyphenylene ether chains that cannot fully undergo the chain redistribution reaction; then, add a large amount of Methanol was stirred vigorously to fully separate the hydroxyl-terminated polyphenylene ether oligo...

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Abstract

The invention belongs to the technical field of communication materials, and particularly relates to a flame-retardant polyarylether-based composition and a prepreg and a thermosetting high-frequency copper-clad plate prepared from the flame-retardant polyarylether-based composition. The flame-retardant polyarylether composition is prepared by combining a necessary vinyl-terminated polyarylether oligomer, a cross-linking agent, modified resin, a filler, an initiator and an unnecessary flame retardant; and the prepreg and the copper-clad plate which are finally prepared have the advantages of outstanding flame retardance, excellent dielectric property, and overall performance meeting high-frequency communication requirements.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and in particular relates to a flame-retardant polyarylether-based composition and a prepreg and a thermosetting high-frequency copper-clad laminate prepared therefrom. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones and intelligent robots, and are one of the key materials in the electronic communication and information industries. Traditional thermosetting resins represented by epoxy resin, phenolic resin and cyanate resin have the advantages of high thermo-mechanical properties, high quality and low price, convenient processing and strong versatility. Common materials for substrates. [0003] However, the rapid development of electronic communication and information industry nowadays requires copper clad laminates to have more superior dielectric...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L47/00C08L35/06C08L27/18C08K3/36C08K3/22C08K5/03C08K7/28B32B17/02B32B17/12B32B15/20B32B15/14B32B37/06B32B37/10
CPCC08L71/126B32B5/02B32B5/26B32B15/20B32B15/14B32B37/06B32B37/10B32B2260/021B32B2260/046B32B2262/101B32B2457/00B32B2307/3065C08L2205/03C08L2205/025C08L2203/20C08K2003/2227C08L47/00C08K3/36C08K3/22C08K5/03C08L35/06C08L27/18C08K7/28Y02E60/10
Inventor 冯凯俞卫忠俞丞顾书春
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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