Preparation method of insulating paper board

A technology for insulating cardboard and cardboard, applied in the direction of machining/deformation, etc., can solve the problems of uneven density, easy existence of holes and water channels in the final product, uneven thickness, etc.

Active Publication Date: 2021-07-30
WEIFANG HUISHENG INSULATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing processing method is to use veneers (cardboards with a thickness less than 10mm) and glue them together with an adhesive. The number of veneers is determined according to the thickness of the final product. Before bonding the veneers, they need to be dried to remove excess water. It is necessary to cool down the veneers to meet the temperature requirements of the adhesive, then apply glue or pad adhesive paper between adjacent veneers, and finally apply pressure to bond to the required thickness to obtain the final product. The process of the whole process More cumbersome, long processing cycle
Moreover, due to the adhesive contained in this production process, holes and waterways are prone ...

Method used

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  • Preparation method of insulating paper board
  • Preparation method of insulating paper board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment one: The manufacture method of prior art (containing binder) 50mm cardboard:

[0029] 1. Cutting of the finished veneer: Take 17 sheets of 3mm cardboard, and cut the cardboard according to the size of the required product.

[0030] 2. Pad spacer stays: place spacer stays between the cardboards, and place different numbers of stays between each adjacent cardboard. The number of stays is determined according to the size of the finished product, and the distance between the stays does not exceed 300mm.

[0031] 3. Cardboard drying: Put the cardboard with the stays into the hot air circulation drying oven, dry at 125°C, and the drying time is more than 36 hours, subject to the final cardboard moisture being less than 1%.

[0032] 4. Cardboard cooling: Run the dried cardboard to the glue coating area, and use a fan to cool down. The cooling time is about 2 hours.

[0033] 5. Glue application: Use a glue applicator to apply glue to the cardboard, and stack the c...

Embodiment 2

[0036] Embodiment two: 10mm cardboard production of the present invention:

[0037] 1. Take wet cardboard: Take the wet cardboard corresponding to the finished product 10mm in thickness of about 36mm, and the quantity is 1 piece.

[0038] 2. Wet cardboard humidification and stacking: add water to the surface of the wet cardboard until the water surface evenly covers the cardboard surface, and use plastic rollers to roll.

[0039] 3. Stand still: put the stacked cardboards for 6 hours to make the moisture of the wet cardboards more uniform.

[0040] 4. Mold on wet cardboard: Place the wet cardboard on the mold with stainless steel mesh.

[0041] 5. Wet cardboard pressing:

[0042] ① Pre-pressing: Start the pressing button, manual control, the initial set pressure is 1Mpa, gradually increase the pressure, a single increase of 0.2Mpa, with the continuous loss of moisture in the wet cardboard, the pressure will gradually decrease, until the pressure drops to the last set press...

Embodiment 3

[0045] Embodiment three: 15mm cardboard production:

[0046] 1. Take wet cardboard: take wet cardboard with a thickness of 27mm wet cardboard, and the quantity is 2 pieces.

[0047] 2. Wet cardboard humidification, stacking: Add water to the surface of the first cardboard until the water evenly covers the surface of the cardboard, and use a plastic roller to roll the surface of the second layer of cardboard in the same way as the first cardboard, and then Place the bottom surface of the second cardboard with the top surface of the first cardboard, edge-aligned and stacked.

[0048] 3. Stand still: put the stacked cardboards for 6 hours to make the moisture of the wet cardboards more uniform.

[0049] 4. Mold on wet cardboard: Place the wet cardboard on the mold with stainless steel mesh.

[0050] 5. Wet cardboard pressing:

[0051] ① Pre-pressing: Start the pressing button, manual control, the initial set pressure is 1Mpa, gradually increase the pressure, a single increas...

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PUM

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Abstract

The invention discloses a preparation method of an insulating paper cylinder. The method comprises the following steps of: selecting the thicknesses and the quantity of veneers according to the thickness of a final product, carrying out humidifying, stacking, standing and mold loading, carrying out cold pressing and hot pressing on a wet paper board on a mold, and finally carrying out cutting and forming. According to the preparation method, the defects caused by an adhesive can be effectively removed in the preparation of the insulating paper board with the thickness of 10-50mm, and the overall quality and the production efficiency of the insulating paper board are improved.

Description

technical field [0001] The invention belongs to the technical field of insulating product production, and in particular relates to a preparation method of insulating cardboard. Background technique [0002] Laminated cardboard is a widely used material in transformer insulation parts. Generally speaking, insulating cardboard parts with a thickness of more than 10mm need to be processed with laminated cardboard. The existing processing method is to use veneers (cardboards with a thickness less than 10mm) and glue them together with an adhesive. The number of veneers is determined according to the thickness of the final product. Before bonding the veneers, they need to be dried to remove excess water. It is necessary to cool down the veneers to meet the temperature requirements of the adhesive, then apply glue or pad adhesive paper between adjacent veneers, and finally apply pressure to bond to the required thickness to obtain the final product. The process of the whole proces...

Claims

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Application Information

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IPC IPC(8): B31F1/00
CPCB31F1/0035
Inventor 闫守贵张斌薛冬冬
Owner WEIFANG HUISHENG INSULATION TECH
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