Elastic electric interconnector with varied lateral sections

Abstract

Resilient electrical interconnects are provided which have a non-uniform cross section which achieves an increased range of deflection and a predetermined relationship between compression force and deflection of the interconnect, and between resistance and deflection of the interconnect. A smaller cross sectional area decreases the spring rate, or compression force, of the interconnect during compression. Increased range of deflection and reduced spring rate enables improved compensation for surface irregularities and facilitates mounting of integrated circuit or other devices having large arrays of interconnects. The non-uniform cross section is provided by a single or compound slope, or alternatively a nonlinear curve, from the end of smaller cross-section to the end of larger cross-section.

Description

technical field [0001] The present invention relates generally to electrical interconnects, and more particularly to resilient electrical interconnects. Background technique [0002] Resilient interconnects that provide electrical connection between opposing planar surfaces are known and generally comprise an elastomeric or polymeric material containing conductive particles distributed provide a conductive path between them. In one form, as shown in patent application Ser. No. 08 / 736,830 filed October 28, 1996, the interconnect is in the form of an elongated column providing an electrically conductive gap between its ends or surfaces. path. [0003] Such resilient interconnects may be used to provide electrical connections between a printed circuit board and an integrated circuit or other device. At this time, the elastic interconnects are arranged in openings in a substrate, the openings being arranged in a predetermined manner. Such a substrate may be the circuit board...

AI Technical Summary

Problems solved by technology

The amount of force required may prevent mounting

Furthermore, as the number of interconnects employed increases, so does the risk that a satisfactory connection cannot be made for all interconnects, especially if the surface of the mating circuit board is warped or uneven

In some cases, a resistive interconnect will not be compressed enough to establish electrical contact or proper electrical contact, while in other cases, a resilient interconnect may be overly compressed, causing misalignment. occur

This misalignment of the resilient interconnect with the mating contacts may result in improper engagement of the interconnect with an adjacent contact or shorting of one or more contacts

Images