Large-span gas film ultralow-temperature environment heat insulation device

Abstract

The invention discloses a large-span gas film ultralow-temperature environment heat insulation device. The large-span gas film ultralow-temperature environment heat insulation device comprises a gas film and a heat insulation pasting material layer, wherein the edge of the gas film is sealed on a base body to define a building space; the heat insulation material pasting layer is located in the building space, and the heat insulation material pasting layer is pasted on the inner wall of the gas film through an adhesive. The large-span gas film ultralow-temperature environment heat insulation device is good in heat insulation and heat preservation effect and is particularly suitable for ultralow-temperature environments such as refrigeration houses and ski fields, the requirement for the heat insulation and heat preservation effect in the environments is met, and the energy consumption and the operation cost are reduced; in addition, the service life is long, and the structure is simple.

Description

technical field [0001] The invention relates to air-film buildings, in particular to a large-span air-film ultra-low temperature environment heat insulation device. Background technique [0002] Air film building refers to a building structure system that uses special architectural membrane materials as the shell and is equipped with a set of intelligent electromechanical equipment to provide positive air pressure inside the air film building and support the main body of the building. [0003] Air film buildings are mostly used in sports venues, warehouses, industrial plants, cold storage, ski resorts and other scenarios. Among them, when used in ultra-low temperature environments such as cold storage and ski resorts, the thermal insulation performance of the air film is high, such as the temperature of the cold storage It needs to be maintained at -18°C or lower, and the temperature of the ski resort needs to be maintained at around -5°C. In these ultra-low temperature envi...

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Problems solved by technology

[0004] refer to Figure 1 to Figure 2 As shown, a kind of air film insulation structure is disclosed in the related art, in which a number of air pillows 11' are arranged on the inner wall of the air film 10', and thermal insulation materials 12' are filled in the air pillows 11'. The position between the adjacent two air pillows 11' cannot be covered by the thermal insulation material 12', therefore, between the two adjacent air pillows 11', due to the temperature difference between the inside and outside of the air film 10', it is easy to form cold Bridge phenomenon, and cold bridge phenomenon is an important factor for high energy consumption

In addition, when filling the thermal insulation material 12', it is necessary to penetrate the sheet-shaped thermal insulation material 12' into the air pillow 11' when the air pillow 11' is inflated. Due to the difficulty of construction, the thermal insulation material 12' is usually not fully filled. The air pillow 11' has no positions filled with thermal insulation material 12' on both sides, which will also cause increased power consumption, and the thermal insulation effect is poor, so it is difficult to meet the thermal insulation requirements in ultra-low temperature environments

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