Scanning microscopic ultrafast laser machining system based on dynamic field butting

Abstract

The invention discloses a scanning microscopic ultrafast laser machining system based on dynamic field butting. The system comprises a workbench, a femtosecond laser, a scanning galvanometer, an objective lens, a 4f unit and a controller, wherein the workbench is used for placing a workpiece; the femtosecond laser is used for generating femtosecond laser beams; the scanning galvanometer is arranged on a light path of the femtosecond laser, and after the femtosecond laser beam is reflected by the scanning galvanometer, dynamic linear scanning of the femtosecond laser beam in a plane area range can be realized; the objective lens is arranged on a light path of the scanning galvanometer and is used for focusing the femtosecond laser beam output by the scanning galvanometer to the surface of the workpiece; the 4f unit is arranged between the scanning galvanometer and the objective lens and is used for enabling the scanning range of the galvanometer to pass through the objective lens to the maximum extent; and the controller is used for continuously outputting the femtosecond laser beams output by the scanning galvanometer to a to-be-machined area of the workpiece. According to the system, the laser is controlled to conduct seamless large-area machining by utilizing a dynamic field butting scanning microscopy technology, so that high-precision and high-efficiency machining is realized.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a scanning microscopic ultrafast laser high-precision and high-efficiency processing system based on dynamic field of view splicing. Background technique [0002] Due to the advantages of high precision and compatibility with various materials, laser processing is especially suitable for combining with computer numerical control technology to build a high-precision automatic processing system. Laser cutting, laser welding, laser lithography and other processing technologies have been used in various fields Has been widely used. [0003] With the emergence of ultrafast femtosecond laser technology in the 1980s, laser micromachining technology ushered in further development. The femtosecond laser pulse has an extremely short pulse width, and the interaction time with the material is extremely short, which greatly reduces the thermal effect in the laser process...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above defects or improvement needs of the prior art, the present invention provides a scanning microscopic ultrafast laser processing system based on dynamic field of view stitching, which combines high-efficiency, high-precision scanning microscopic technology with three-axis servo The combination of the translation stage realizes the synchronization of the scanning microscope and the three-axis servo translation stage, so that materials much larger than the field of view of the scanning microscope can be processed continuously, efficiently and with high precision, without the need to splice the various areas together, eliminating the need for laser processing Stitching errors and reduced processing quality due to overlap and mismatch

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