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Photosensitive chip assembly, camera module and electronic equipment

A technology of photosensitive chips and components, applied in the field of photography, can solve the problems of poor photo quality, clear center and surrounding blur, etc., and achieve the effect of improving photo quality.

Active Publication Date: 2021-07-16
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The deformation direction of the photosensitive chip is opposite to the image plane of the lens, which causes the camera to take pictures with a clear center and blurred surroundings, resulting in poor picture quality

Method used

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  • Photosensitive chip assembly, camera module and electronic equipment
  • Photosensitive chip assembly, camera module and electronic equipment
  • Photosensitive chip assembly, camera module and electronic equipment

Examples

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Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0049] The inventors of the present application have found through a large number of experiments that there is a photosensitive chip in the camera module of the camera, and the photosensitive chip is often bent during the module assembly process. The reasons for the bending include the influence of external forces and the internal influence of the photosensitive chip. Among them, the internal factors of the photosensitive chip will have a greater impact on the bending of the ph...

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Abstract

The invention provides a photosensitive chip assembly, a camera module and electronic equipment. The photosensitive chip assembly comprises a photosensitive chip and a compensation film, and the photosensitive chip comprises a microlens array; the compensation film is arranged on the back surface of the photosensitive chip, and the thermal expansion coefficient of the compensation film is greater than or equal to that of the micro-lens array.

Description

technical field [0001] The present application relates to the field of imaging technology, in particular to photosensitive chip components, camera modules and electronic equipment. Background technique [0002] At present, the pixels of the camera are getting larger and larger, and the area of ​​the photosensitive chip inside is required to be larger and larger. [0003] Due to the increase in the area of ​​the photosensitive chip, the ratio of the area to the thickness of the photosensitive chip is relatively large, and the photosensitive chip is prone to deformation during manufacturing, especially in an environment where the temperature rises. figure 1 shown. [0004] Since the central area of ​​the photosensitive chip protrudes upwards, the photosensitive area forms a curved surface, which leads to an increase in the field curvature of the photosensitive chip. figure 2 shown. [0005] The deformation direction of the photosensitive chip is opposite to the image plane...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/55Y02P70/50
Inventor 蒋恒孟楠
Owner NINGBO SUNNY OPOTECH CO LTD
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