Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing circuit board with uniformly plated holes

A manufacturing method and circuit board technology, applied in the direction of printed circuit manufacturing, printed circuit, and the formation of electrical connection of printed components, can solve the problems of uneven electroplating, small aperture, burning board, etc., to ensure uniform electroplating, avoid small holes, good effect

Pending Publication Date: 2021-07-02
VICTORY GIANT TECH HUIZHOU CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of uneven electroplating in circuit board plating, resulting in small hole diameter, hole blocking, burning board, etc., the invention provides a method for manufacturing a circuit board with uniform plated holes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing circuit board with uniformly plated holes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In order to describe the technical solutions of the present invention in detail, the technical solutions of the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, not all, embodiments of the present invention.

[0021] A method for manufacturing a circuit board with uniform plated holes, comprising the following steps in sequence:

[0022] The pre-process processing forms a multi-layer circuit board; the pre-process processing includes cutting, inner layer graphics, inner layer AOI, pressing and cutting and grinding in turn. Specifically, the cutting cuts multiple substrates and the subsequent pressing The substrate located in the inner layer of the circuit board is used to make the inner layer graphics, and the inner layer AOI ensures the quality, and the qualified substrates are pressed together.

[0023] Drilling and board electrical: preset plated hole area and non-plated hole area on...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for manufacturing a circuit board with uniformly plated holes, and the method sequentially comprises the following steps: carrying out the pre-process treatment, and forming a multi-layer circuit board; performing drilling and copper plating: presetting a hole plating area and a hole non-plating area on the circuit board, performing hole drilling in the hole plating area, and performing copper plating on the circuit board after hole drilling; carrying out the hole plating and patterning of the outer layer: determining a to-be-plated hole needing to be plated in a plurality of holes formed by drilling, and performing windowing on the position of the to-be-plated hole, wherein the windowing size is larger than the single side of the to-be-plated hole; performing windowing on the non-plated hole area to form a plurality of exposed dispersed current pads; performing hole plating: thickening the hole copper in the to-be-plated hole; performing board grinding: grinding the plated hole opening and the dispersed current pad, so that the board surface of the circuit board is flat; and carrying out post-process treatment. According to the invention, the hole plating effect is good, the problems of small hole size, hole blockage or plate burning are avoided, the current dispersion pad plays a role in dispersing current, uniform electroplating during hole plating is ensured, and the product quality is improved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a circuit board with evenly plated holes. Background technique [0002] With the development of circuit boards, the requirements for the quality and reliability of circuit boards are getting higher and higher. In order to obtain higher reliability, the requirements for through-hole copper are correspondingly higher, especially in the connection heat dissipation area. , the minimum value required for hole copper thickness is even 2mil, while the line width and spacing are generally 4mil. The conventional primary copper and secondary copper processes cannot fully meet the requirements of hole copper thickness and line size. In the prior art, after the circuit board is drilled, the formed through hole is directly subjected to copper plating plating. Because the plated area is small, the current is concentrated at the hole position when the hole is plated, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/42H05K3/00
CPCH05K3/426H05K3/427H05K3/0047
Inventor 张国城张军杰张峰吴柳松
Owner VICTORY GIANT TECH HUIZHOU CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com