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Base terminal bonding pad structure, lens driving device, camera device and electronic product

The technology of a lens driving device and a camera device is applied in the direction of electromechanical devices, motor generator connectors, circuits, etc., and can solve problems such as difficult solder entering between conductive components and pads, weak soldering, and virtual soldering, etc., to achieve Solve soldering process problems, facilitate dispensing and fixing, and increase the effect of contact area

Pending Publication Date: 2021-07-02
NEW SHICOH MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the base terminal is welded with conductive components, the base terminal is provided with a pad exposed on the outside, and the thickness is about 0.1mm, and the corresponding conductive component is attached to the pad. During welding, the pad is thin and conductive. The components are attached to the pads. The existing soldering process is difficult to solder the pads, and it is not easy for solder to enter between the conductive components and the pads, and the contact area of ​​the solder is small, which may easily lead to weak soldering and virtual soldering.

Method used

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  • Base terminal bonding pad structure, lens driving device, camera device and electronic product
  • Base terminal bonding pad structure, lens driving device, camera device and electronic product
  • Base terminal bonding pad structure, lens driving device, camera device and electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment 1: as Figure 1 to Figure 4 As shown, there is a notch on the side wall of the pad 3 facing the center of the base body 1, the notch is a C-shaped notch 4, and a chamfer 5 is provided on the edge of the C-shaped notch 4, and the conductive element corresponding to the pad 3 The device is attached to the pad 3 and covers the C-shaped notch 4. In this embodiment, the conductive component can be an FPC board, and the FPC board is fixed on the surface of the base body 1 facing the direction of the lens. In this embodiment, the chamfer 5 is located at the edge of the C-shaped notch 4 on the side away from the conductive components.

[0035] When soldering the pad 3 and the conductive component (that is, the FPC board), the solder paste is set at the position corresponding to the C-shaped notch 4 of the conductive component, and the solder paste is attached to the position of the chamfer 5 and the pad 3 is away from the surface of the conductive component. , throu...

Embodiment 2

[0038] Embodiment 2, differs from Embodiment 1 in that: as Figure 5 As shown, the chamfer 5 is set at the edge of the side of the pad 3 that is attached to the conductive component, that is, the chamfer 5 is located between the pad 3 and the conductive component. When soldering, the solder paste melts into the position of the chamfer 5, and The chamfer 5 forms a cavity for containing solder paste between the pad 3 and the conductive components, and effectively increases the contact area between the pad 3 and the solder paste, thereby improving the strength between the pad 3 and the conductive components.

Embodiment 3

[0039] Embodiment 3, differs from implementation 1, embodiment 2 in that: as Figure 6 As shown, the two edges of the C-shaped notch 4 are provided with chamfers 5. At this time, the size of the chamfers 5 is smaller than the size of the chamfers 5 in Embodiment 1 and Embodiment 2, but the upper and lower sides of the C-shaped notch 4 are provided with chamfers. 5 Effectively increase the solder paste holding space, increase the contact area, and improve the welding strength.

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PUM

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Abstract

The invention discloses a base terminal bonding pad structure, a lens driving device, a camera device and an electronic product, and the key points of the technical scheme are that the base terminal bonding pad structure comprises a base body, the base body is provided with a terminal, the terminal is provided with a bonding pad, the edge position of the bonding pad is provided with a chamfer used for increasing the contact area of soldering tin, and the bonding pad is positioned on the inner side wall of the base body and is exposed. Effective welding between the bonding pad and the conductive component is ensured, the thickness of the bonding pad is reduced, and the tin soldering process is facilitated.

Description

technical field [0001] The invention relates to the field of photographic equipment, in particular to a base terminal pad structure, a lens driving device, a photographic device and electronic products. Background technique [0002] At present, when the base terminals of the voice coil motor (VCM) and other micro-motors used in domestic and foreign micro-cameras are connected to conductive components such as FPC boards, welding connections are generally used to realize the electrical connection between the base and conductive components. [0003] When the base terminal is welded with conductive components, the base terminal is provided with a pad exposed on the outside, and the thickness is about 0.1mm, and the corresponding conductive component is attached to the pad. During welding, the pad is thin and conductive. The components are attached to the pads. The existing soldering process is difficult to solder the pads, and it is not easy for solder to enter between the condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/65H01R4/02H01R13/02H02K5/22G02B7/08G03B30/00
CPCH01R12/65H01R4/029H01R13/02H02K5/225G02B7/08H01R2201/10
Inventor 吴攀德
Owner NEW SHICOH MOTOR CO LTD
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