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High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof

A polyimide film, high thermal conductivity technology, used in flat products, other household appliances, applications, etc., can solve the problems of fixed structure, the strength and thermal conductivity of polyimide film cannot meet product requirements, and the quality of use is reduced. , to achieve the effect of convenient cutting

Pending Publication Date: 2021-07-02
常熟市方舟绝缘材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The strength and thermal conductivity of the existing polyimide film cannot meet the product requirements, which reduces the quality of use. At the same time, the structure of the existing cutting device is fixed, so it is not easy to adjust to meet different production specifications.

Method used

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  • High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof
  • High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof
  • High-strength and high-thermal-conductivity polyimide film and preparation method and cutting equipment thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A high-strength and high-thermal-conductivity polyimide film, the high-strength and high-thermal-conduction polyimide film is composed of the following raw materials in parts by mass: 65 parts of 3,3',4,4'-biphenyltetracarboxylic dianhydride , 48 parts of p-phenylenediamine, 5.8 parts of flake graphite and 3.6 parts of nanocrystalline diamond.

[0038]A preparation method of a high-strength and high-thermal-conductivity polyimide film, the steps of the preparation method are as follows:

[0039] Step 1. Dissolve p-phenylenediamine in a polar aprotic solvent, add 3,3',4,4'-biphenyltetracarboxylic dianhydride, control the temperature of the reaction solution at 26°C, and stir at 200r / min for 2.8h , to obtain a polyamic acid solution;

[0040] Step 2: adding flake graphite and nanocrystalline diamond into polyamic acid, dispersing evenly, the solution undergoes vacuum-assisted ultrasonic degassing, casting the defoamed solution in a casting machine, and then drying;

[0...

Embodiment 2

[0043] A high-strength and high-thermal conductivity polyimide film, the high-strength and high thermal conductivity polyimide film is composed of the following raw materials in parts by mass: 45 parts of 3,3',4,4'-biphenyltetracarboxylic dianhydride , 42 parts of p-phenylenediamine, 5.5 parts of flake graphite and 4.2 parts of nanocrystalline diamond.

[0044] A preparation method of a high-strength and high-thermal-conductivity polyimide film, the steps of the preparation method are as follows:

[0045] Step 1. Dissolve p-phenylenediamine in a polar aprotic solvent, add 3,3',4,4'-biphenyltetracarboxylic dianhydride, control the temperature of the reaction solution at 24°C, and stir at 200r / min for 3.5h , to obtain a polyamic acid solution;

[0046] Step 2: adding flake graphite and nanocrystalline diamond into polyamic acid, dispersing evenly, the solution undergoes vacuum-assisted ultrasonic degassing, casting the defoamed solution in a casting machine, and then drying;

...

Embodiment 3

[0049] A high-strength and high-thermal conductivity polyimide film, the high-strength and high thermal conductivity polyimide film is composed of the following raw materials in parts by mass: 45 parts of 3,3',4,4'-biphenyltetracarboxylic dianhydride , 42 parts of p-phenylenediamine, 6.2 parts of flake graphite and 4.8 parts of nanocrystalline diamond.

[0050] A preparation method of a high-strength and high-thermal-conductivity polyimide film, the steps of the preparation method are as follows:

[0051] Step 1. Dissolve p-phenylenediamine in a polar aprotic solvent, add 3,3',4,4'-biphenyltetracarboxylic dianhydride, control the temperature of the reaction solution at 18°C, and stir at 200r / min for 3.2h , to obtain a polyamic acid solution;

[0052] Step 2: adding flake graphite and nanocrystalline diamond into polyamic acid, dispersing evenly, the solution undergoes vacuum-assisted ultrasonic degassing, casting the defoamed solution in a casting machine, and then drying;

...

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Abstract

The invention discloses a high-strength and high-thermal-conductivity polyimide film and a preparation method and cutting equipment thereof, and relates to the field of polyimide films. The high-strength and high-thermal-conductivity polyimide film comprises the following raw materials in parts by mass: 45-65 parts of 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 32-48 parts of p-phenylenediamine, 5.5-6.2 parts of crystalline flake graphite and 3.6-4.8 parts of nanocrystalline diamond. Through the scheme, 3,3',4,4'-biphenyl tetracarboxylic dianhydride and p-phenylenediamine serve as raw materials of the high-strength and high-thermal-conductivity polyimide film, the crystalline flake graphite and the nanocrystalline diamond are added into the raw materials, when the crystalline flake graphite is added, the crystallinity of the nanocrystalline diamond is reduced, crystallization and activation of the nanocrystalline diamond are facilitated, and the tensile strength is improved; meanwhile, the nanocrystalline diamond is beneficial to improvement of the heat conductivity coefficient of the composite material; in addition, the preparation method is simple, and the production requirements of enterprises are reduced.

Description

technical field [0001] The invention relates to the field of polyimide films, in particular to high-strength and high-thermal-conductivity polyimide films, a preparation method and cutting equipment thereof. Background technique [0002] Polyimide film is one of the earliest products of polyimide, which is used for slot insulation of motors and wrapping materials for cables. Thermoset polyimides have excellent thermal stability, chemical resistance, and mechanical properties, and are typically orange in color. Polyimide film is widely used in the fields of electrical / electronic materials, space / aviation and electrical communication because of its excellent mechanical and thermal dimensional stability and chemical stability. [0003] With the advancement of technology, in some high-end electrical and electrical equipment fields, higher requirements are put forward for the mechanical properties and thermal conductivity of polyimide films. The strength and thermal conductivit...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K3/04C08J5/18C08G73/10B26D1/09B26D5/08B26D7/26B29D7/01
CPCC08J5/18C08G73/1067C08G73/1007B29D7/01B26D1/095B26D5/086B26D7/2628C08J2379/08C08K3/04C08K2201/011C08K2201/014
Inventor 宋丽英方晓栋方晓柯
Owner 常熟市方舟绝缘材料有限责任公司
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