Brazing welding method for circular target material and back plate

Abstract

The invention relates to a brazing welding method for a circular target material and a back plate. The method comprises the following steps that the target material and the back plate with a groove are prepared firstly, the bottom surface of the groove is a back plate welding surface, welding flux is placed on a target material welding surface and the back plate welding surface respectively, the temperature is raised, and the molten welding flux is used for infiltration treatment; then, the welding flux is placed in the groove of the back plate subjected to infiltration treatment, copper wires with the diameter being 0.5-0.6 mm are arranged at equal intervals, and the treated back plate is obtained; and the treated target material and the treated back plate are buckled and assembled, a pressing block is placed on a sputtering face of the target material, cooling is conducted, and a circular target material assembly is obtained. According to the method, the diameter of the copper wires serving as supporting strips is limited to be 0.5-0.6 mm, compared with the diameter of copper wires in the prior art, the diameter of the copper wires is increased, a welding flux layer can be thickened, the welding binding rate is increased to be larger than or equal to 97%, and the single defect rate is reduced to be smaller than or equal to 1.5%.

Description

technical field [0001] The invention relates to the technical field of brazing and welding, in particular to a brazing and welding method for a circular target and a back plate. Background technique [0002] Sputtering is one of the main technologies for preparing thin film materials. It uses ions generated by ion sources to accelerate and gather in a vacuum to form a high-speed energy ion beam, which bombards the solid surface, and the kinetic energy exchange occurs between the ions and the solid surface atoms. The atoms on the surface of the solid are separated from the solid and deposited on the surface of the substrate. The bombarded solid is the raw material for preparing the sputtering deposition film, which is generally called a sputtering target. [0003] Since metal sputtering targets are often made of high-purity aluminum, copper, titanium, nickel, tantalum and other relatively expensive metal materials, and the strength of metal sputtering targets varies, in the a...

AI Technical Summary

Problems solved by technology

[0007] Although the prior art discloses the use of copper wire in the brazing welding process, the diameter of the copper wire is not limited, and in the actual production process, there is still a problem of low welding bonding rate. For this reason, the present invention proposes A kind of brazing welding method of circular target material and back plate