Water-cooling high-power full-bridge unit based on crimping type IGCT
A high-power, crimp-type technology, applied in the direction of output power conversion devices, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of large thermal resistance of module packaging devices, improve power density and reduce failure rate , the effect of strong flow capacity
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[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] Such as Figure 1-3 As shown, a water-cooled high-power full-bridge unit based on a press-fit IGCT, the unit includes: a power supply module 2; an IGCT full-bridge power module 1 installed under the power supply module 2; a DC capacitor module 3 connected through The busbar 4 is connected to the IGCT full-bridge power ...
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