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A kind of fast green environmental protection double-sided polishing method of silicon wafer substrate

A green and double-sided polishing technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of low polishing process time cost, difficulty in conforming to the epitaxial process, increasing substrate stress, etc., to shorten the processing time , rapid polishing, and the effect of reducing surface defects and damage

Active Publication Date: 2021-09-14
广西立之亿新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the general chemical mechanical polishing process takes more than 4 hours. The chemical mechanical polishing method is divided into three steps, rough polishing, semi-finish polishing, and fine polishing. The lower material removal rate makes the time cost of the polishing process higher and greatly The increased stress in the substrate makes its surface shape very poor and it is difficult to meet the requirements of the epitaxial process
During the polishing process, it is necessary to add certain chemical reagents such as strong acid, strong alkali and strong oxide, which are dangerous and harmful to the operator and the operating environment, and special waste liquid treatment is required, which does not conform to the development concept of modern green and environmentally friendly processing.

Method used

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  • A kind of fast green environmental protection double-sided polishing method of silicon wafer substrate
  • A kind of fast green environmental protection double-sided polishing method of silicon wafer substrate
  • A kind of fast green environmental protection double-sided polishing method of silicon wafer substrate

Examples

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Effect test

Embodiment 1

[0027] A kind of fast green environmental protection double-side polishing method of silicon wafer substrate, comprises the following steps:

[0028] (1) Loading: Take five 4-inch silicon wafer substrates and place them in the star wheel;

[0029] (2) Rough polishing: the silicon wafer substrate is chemically mechanically polished with a rough polishing solution, and after polishing, it is ultrasonically cleaned with deionized water and ethanol for 10 min, and dried; the rough polishing solution is composed of cerium oxide, deionized water, Prepared from dispersant and pH adjusting agent;

[0030] (3) Fine polishing: the silicon wafer substrate is chemically mechanically polished with a fine polishing solution after rough polishing, ultrasonically cleaned with deionized water and ethanol for 10 minutes respectively after polishing, and dried; the fine polishing solution is composed of cerium oxide, deionized Prepared with ionized water and dispersant.

[0031] In the present...

Embodiment 2

[0035] A kind of fast green environmental protection double-side polishing method of silicon wafer substrate, comprises the following steps:

[0036] (1) Loading: Take five 4-inch silicon wafer substrates and place them in the star wheel;

[0037] (2) Rough polishing: the silicon wafer substrate is chemically mechanically polished with a rough polishing solution, and after polishing, it is ultrasonically cleaned with deionized water and ethanol for 10 min, and dried; the rough polishing solution is composed of cerium oxide, deionized water, Prepared from dispersant and pH adjusting agent;

[0038] (3) Fine polishing: the silicon wafer substrate is chemically mechanically polished with a fine polishing solution after rough polishing, ultrasonically cleaned with deionized water and ethanol for 10 minutes respectively after polishing, and dried; the fine polishing solution is composed of cerium oxide, deionized Prepared with ionized water and dispersant.

[0039] In the present...

Embodiment 3

[0043] A kind of fast green environmental protection double-side polishing method of silicon wafer substrate, comprises the following steps:

[0044] (1) Loading: Take five 4-inch silicon wafer substrates and place them in the star wheel;

[0045] (2) Rough polishing: the silicon wafer substrate is chemically mechanically polished with a rough polishing solution, and after polishing, it is ultrasonically cleaned with deionized water and ethanol for 10 min, and dried; the rough polishing solution is composed of cerium oxide, deionized water, Prepared from dispersant and pH adjusting agent;

[0046](3) Fine polishing: the silicon wafer substrate is chemically mechanically polished with a fine polishing solution after rough polishing, ultrasonically cleaned with deionized water and ethanol for 10 minutes respectively after polishing, and dried; the fine polishing solution is composed of cerium oxide, deionized Prepared with ionized water and dispersant.

[0047] In the present ...

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Abstract

The invention relates to the technical field of ultra-precision processing of semiconductors, in particular to a fast, green and environment-friendly double-sided polishing method for a silicon wafer substrate. A method for quickly green and environmentally friendly double-sided polishing of a silicon wafer substrate comprises the following steps: (1) rough polishing: the silicon wafer substrate is chemically mechanically polished with a rough polishing solution; the rough polishing solution is composed of cerium oxide, Ionized water, dispersant and pH adjustment agent are prepared; (2) fine polishing: the silicon wafer substrate is carried out chemical mechanical polishing with fine polishing liquid after rough polishing; The fine polishing liquid is made of cerium oxide, deionized water and Dispersants are prepared. The polishing method of the present invention adopts a two-step chemical mechanical polishing method. By adopting cerium oxide polishing fluids of different particle sizes, different polishing pads and different pH conditions, and controlling the pressure of the polishing disc and the rotational speed ratio of the central gear, the silicon wafer can be effectively improved. The polishing efficiency of the substrate is high, and the average thickness difference of the polished substrate is small, and the bending and warpage are low.

Description

technical field [0001] The invention relates to the technical field of ultra-precision processing of semiconductors, in particular to a fast, green and environment-friendly double-sided polishing method for a silicon wafer substrate. Background technique [0002] The substrate material is an important upstream product in the semiconductor industry. Its usual preparation method is to obtain crystal ingots through crystal growth. The crystal ingots are cut, ground, mechanically polished, chemically mechanically polished, cleaned, and packaged to obtain crystals that can be used for Out-of-the-box substrate wafers for epitaxy. The requirements of the epitaxial process for the substrate include no damage or scratch on the surface, low thickness difference, small bending and warpage, and good surface flatness. [0003] During the processing of the substrate material, the long-time grinding and polishing process will bring processing stress to the substrate sheet, making its surf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
CPCH01L21/02013H01L21/02024
Inventor 钱金龙王堃吴胜文黄华翠
Owner 广西立之亿新材料有限公司
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