High-thermal-conductivity aluminum-based circuit board and preparation process thereof

Abstract

The invention discloses a high-thermal-conductivity aluminum-based circuit board and a preparation process thereof. The high-thermal-conductivity aluminum-based circuit board comprises a circuit board body, wherein the interior of the circuit board body comprises a fixed substrate, the upper end of the fixed substrate is fixedly connected with an electrical element, the lower end of the fixed substrate is fixedly connected with a heat dissipation block, the outer side of the heat dissipation block is fixedly connected with a first fixing colloid, the outer side of the first fixing colloid is fixedly connected with a heat dissipation frame, the heat dissipation frame is fixedly connected with the heat dissipation block through the first fixing colloid, the outer side of the circuit board body is fixedly connected with a third fixing colloid, the outer side of the third fixing colloid is fixedly connected with an edge sealing strip, the outer side of the edge sealing strip is fixedly connected with heat dissipation fins, a filling groove is formed in the edge sealing strip, the filling groove is filled with a heat dissipation medium, and a heat dissipation groove is formed in the heat dissipation frame. According to the high-thermal-conductivity aluminum-based circuit board and the preparation process thereof, the whole circuit board is prevented from being damaged due to overheating, an overall heat dissipation speed is increased, and therefore, overall service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of aluminum-based circuit board processing, in particular to an aluminum-based circuit board with high thermal conductivity and a preparation process thereof. Background technique [0002] Aluminum-based circuit board is a circuit board called PCB circuit board. PCB aluminum substrate is a unique metal-based copper clad laminate. PCB aluminum substrate has good thermal conductivity, electrical insulation performance and mechanical processing performance. The thermal insulation layer is PCB aluminum The core technology of the substrate is generally composed of a special polymer filled with special ceramics. It has small thermal resistance, excellent viscoelastic properties, thermal aging resistance, and can withstand mechanical and thermal stress. IMS-H01, IMS-H02 and LED-0601 and other high-performance PCB aluminum substrate thermal insulation layer is using this technology, so that it has excellent thermal ...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a high thermal conductivity aluminum-based circuit board and its preparation process, in order to solve the aluminum-based circuit board proposed in the above background technology, the overall heat dissipation effect is poor, and the situation of damage due to excessive temperature often occurs, which reduces the overall service life, and the whole process of preparation cannot be designed for the poor heat dissipation effect of aluminum-based circuit boards, resulting in slow overall heat dissipation speed, thereby reducing the overall practicability, and the overall structure of existing aluminum-based circuit boards is general, During heat dissipation, the heat of each part cannot be dissipated quickly at the same time, resulting in poor contact of important parts due to heat, which reduces the overall practicality

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