Method for monitoring ground subsidence of mining subsidence area based on three-dimensional laser scanning
A technology of three-dimensional laser and subsidence area, which is applied in the directions of measuring devices, surveying and navigation, height/horizontal measurement, etc. It can solve the problems of increased transmission error, complicated operation, unstable tripod, etc., and achieves increased leveling range and accuracy and high stability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0065] Below in conjunction with accompanying drawing, the present invention is described in further detail:
[0066] according to Figure 1~Figure 13 As shown, a method for monitoring ground subsidence in mining subsidence areas based on 3D laser scanning,
[0067] Step S01. According to the scope of the mining subsidence area and the optimal scanning radius of the three-dimensional laser scanner 5, a plurality of stations are arranged on the surface around the periphery of the mining subsidence area, such as figure 1 Shown; The distance between two adjacent stations around the mining subsidence area is twice the optimal scanning radius of the three-dimensional laser scanner 5, and the distance between the center of the mining subsidence area and each station station is no more than twice the three-dimensional laser scanning The scanning radius of instrument 5, makes the area of all circles drawn with each station point as the center position cover the mining subsidence ar...
PUM

Abstract
Description
Claims
Application Information

- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com