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Preparation method of high-reliability sheet-shaped getter without particle falling risk

A particle-free, flake-shaped technology, applied in chemical instruments and methods, inorganic chemistry, gaseous chemical plating, etc., can solve the problems of large investment in manufacturing equipment, low production efficiency, high operating costs, etc., and achieve equipment investment and operating costs low, efficiency-enhancing effect

Pending Publication Date: 2021-06-01
NANJING HUADONG ELECTRONICS VACUUM MATERIAL
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The present invention proposes a highly reliable flake-shaped getter and its preparation method without the risk of particle shedding. Low level defects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Cut the TA1 titanium alloy with a thickness of 0.1mm into the required sheet shape. Using electroplating formula, with 10mA·cm -2 The deposition current deposited zinc for 30min. After cleaning and drying, it was kept in a vacuum furnace at 350°C for 2 hours for surface alloying, and finally the sheet was soaked in 90°C sodium hydroxide solution for 3 hours to remove the zinc in the surface alloying, leaving the surface layer with a nanostructure, which is relatively Titanium alloy with huge surface area. Finally, the surface impurities are cleaned by ultrasonic cleaning with deionized water, and then dried.

[0037] After the above-mentioned sample is loaded into the constant pressure method inhalation performance test system, it is activated at 500°C for 10 minutes, and under the pressure of 4E-4Pa, the inhalation rate of hydrogen reaches 1500ml / s·cm 2 , far greater than the 500ml / s cm of the conventional molybdenum-titanium getter 2 , which is mainly due to the h...

Embodiment 2

[0039] A zirconium alloy with a thickness of 200 microns and a zirconium weight of 75% is cut into the required flake shape. Zinc is deposited by CVD. After cleaning and drying, it is kept in a vacuum furnace at 375°C for 1.8h for surface alloying, and finally the sheet is soaked in 78°C sodium hydroxide solution for 3.5h to remove the zinc in the surface alloying, leaving the surface layer with a nanostructure , a zirconium alloy with a large specific surface area. Finally, the surface impurities are cleaned by ultrasonic cleaning with deionized water, and then dried.

[0040] After the above-mentioned sample is loaded into the gas absorption performance test system of the constant pressure method, it is activated at 500°C for 10 minutes, and its gas absorption rate for hydrogen reaches 1950ml / s·cm under the pressure of 4E-4Pa. 2 , far greater than the 500ml / s cm of the conventional molybdenum-titanium getter 2 , which is mainly due to the huge specific surface area obtain...

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Abstract

The invention relates to a high-reliability sheet-shaped getter without a particle falling risk and a preparation method thereof. The preparation method comprises the following steps: etching a nano-structure on the surface of a sheet-shaped titanium alloy with the thickness of less than 1mm and the titanium weight percentage content of more than 50% or a zirconium alloy with the zirconium weight percentage content of more than 50% by a chemical method so as to obtain a huge specific surface area and further to obtain excellent air suction performance. The method has the advantages that the risk of particle falling is avoided; double surfaces are simultaneously processed, so that the efficiency is improved; the production equipment investment and the operation cost are low; and graphical production can be realized.

Description

technical field [0001] The invention relates to a highly reliable flake-shaped getter without the risk of particle shedding and a preparation method thereof, belonging to the technical field of electronic component materials. Background technique [0002] In recent years, with the miniaturization, flattening, and integration of traditional electric vacuum devices, various sensors, and MEMS devices, the getters required for them have gradually changed from evaporative to non-evaporable, and their shapes have also changed. From the traditional cylindrical shape, it has developed into thin film thick film, thin film, and then integrated on the wafer. The size of the getter in the thickness direction has also developed from several millimeters to hundreds of microns, and then developed to several microns. [0003] During the above development process, several patents have disclosed the manufacturing techniques of these getters, and these techniques have more or less defects. ...

Claims

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Application Information

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IPC IPC(8): B01J20/02B01J20/28B01J20/30C23C16/06C23F1/40C23F1/44C25D3/22C25D5/50C25D7/06
CPCB01J20/0211B01J20/28033C25D7/0614C25D3/22C25D5/505C23F1/44C23F1/40C23C16/06Y02E30/30
Inventor 郭卫斌薛函迎柴云川王浏杰
Owner NANJING HUADONG ELECTRONICS VACUUM MATERIAL
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