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Single-component addition type high-temperature-resistant high-thermal-conductivity silica gel and preparation method thereof

A technology of high temperature resistance and addition type, which is applied in the field of one-component addition type high temperature resistance and high thermal conductivity silicone gel and its preparation field, and can solve the problems of thermal resistance, harsh storage conditions and poor thermal conductivity of thermally conductive gels that are not resistant to high temperature. , to achieve the effect of good cohesion, viscosity reduction, bulk strength and toughness improvement

Pending Publication Date: 2021-05-28
SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, traditional thermal silicone gels have problems such as poor thermal conductivity, high temperature resistance, increased thermal resistance of thermal gels after a long time, and harsh storage conditions, so further research is needed

Method used

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  • Single-component addition type high-temperature-resistant high-thermal-conductivity silica gel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides a single-component addition type high temperature resistant high thermal conductivity silicone gel, which includes the following components in parts by weight: 80 parts of vinyl silicone oil, 2 parts of hydrogen-containing silicone oil for crosslinking agent, and 1900 parts of high thermal conductivity filler , 12 parts of treatment agent, 4 parts of catalyst, 4 parts of pigment.

[0031] Wherein, the above-mentioned vinyl silicone oil is vinyl-terminated polydimethylsiloxane with a vinyl content of 0.22 mmoles / g and a viscosity of 250 cSt;

[0032] Based on the total mass of the silicone gel, the above-mentioned hydrogen-containing silicone oil includes 1 part of terminal hydrogen-containing polydimethylsiloxane and 1 part of side hydrogen-containing polydimethylsiloxane; The Si-H content in the polydimethylsiloxane is 1.37mmoles / g, the viscosity is 14cSt, the Si-H content in the hydrogen-containing polydimethylsiloxane is 3mmoles / g, and the vi...

Embodiment 2

[0040] This embodiment provides a single-component addition type high temperature resistant high thermal conductivity silicone gel, which includes the following components in parts by weight: 80 parts of vinyl silicone oil, 3 parts of hydrogen-containing silicone oil for crosslinking agent, and 1900 parts of thermal conductive filler , 12 parts of treatment agent, 4 parts of catalyst, 4 parts of pigment.

[0041] Wherein, the above-mentioned vinyl silicone oil is vinyl-terminated polydimethylsiloxane with a vinyl content of 0.22 mmoles / g and a viscosity of 250 cSt;

[0042]Based on the total mass of the silicone gel, the above-mentioned hydrogen-containing silicone oil includes 1.5 parts of terminal hydrogen-containing polydimethylsiloxane and 1.5 parts of side hydrogen-containing polydimethylsiloxane, and the terminal hydrogen-containing polydimethylsiloxane The Si-H content in the polydimethylsiloxane is 1.37mmoles / g, the viscosity is 14cSt, the Si-H content in the hydrogen-...

Embodiment 3

[0050] This embodiment provides a single-component addition type high temperature resistant high thermal conductivity silicone gel, which includes the following components in parts by weight: 80 parts of vinyl silicone oil, 2 parts of hydrogen-containing silicone oil for crosslinking agent, and 1900 parts of thermally conductive filler , 12 parts of treatment agent; 4 parts of catalyst, 4 parts of pigment.

[0051] Wherein, the above-mentioned vinyl silicone oil is vinyl-terminated polydimethylsiloxane with a vinyl content of 0.19 mmoles / g and a viscosity of 400 cSt;

[0052] Based on the total mass of the silicone gel, the above-mentioned hydrogen-containing silicone oil is 2 parts of hydrogen-containing polydimethylsiloxane at the end and 2 parts of hydrogen-containing polydimethylsiloxane at the side, and 2 parts of hydrogen-containing polydimethylsiloxane at the end. The Si-H content in the polydimethylsiloxane is 1.37mmoles / g, the viscosity is 14cSt, the Si-H content in t...

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Abstract

The invention provides single-component addition type high-temperature-resistant high-thermal-conductivity silica gel and a preparation method thereof. The single-component addition type high-temperature-resistant high-thermal-conductivity silica gel is prepared from the following raw materials in parts by weight: 80 to 100 parts of vinyl silicone oil, 0.1 to 5 parts of cross-linking agent hydrogen-containing silicone oil, 500 to 2000 parts of a thermal-conductive filler, 1 to 20 parts of a treating agent, 1 to 4 parts of a catalyst and 1 to 8 parts of a pigment, and the hydrogen-containing silicone oil comprises at least one of terminated hydrogen-containing polysiloxane and side hydrogen-containing polysiloxane; and the hydrogen content of the end hydrogen-containing polysiloxane is 0.16 to 3.00 mmol / g, and the hydrogen content of the side hydrogen-containing polysiloxane is 0.9 to 9 mmol / g. Compared with silicone grease and silicon gaskets which are frequently used in the market at present, the single-component addition type high-temperature-resistant high-thermal-conductivity silica gel provided by the invention has the advantages of higher heat conductivity coefficient, higher bearing temperature, almost unchanged thermal resistance after long-time aging and the like, and further ensures that a heat-conducting interface material always keeps high heat-conducting efficiency in a long-term use process.

Description

technical field [0001] The invention relates to the technical field of thermally conductive interface materials, in particular to a single-component addition-type high-temperature-resistant high-thermal-conductivity silicone gel and a preparation method thereof. Background technique [0002] With the development of rapid manufacturing technology and the popularization of 5G technology, the fields of electronic components, circuit modules and integrated circuits are developing towards high performance, miniaturization and integration. The problem of electronic heat dissipation is becoming more and more prominent, because the heat is not timely The derivation of electronic devices will reduce the life and reliability of electronic devices, and also affect the safety performance of equipment. Therefore, effective thermal management is crucial to ensure their high performance and reliability. However, thermal management of many electronic devices still relies on basic passive c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K7/18C08K3/22
CPCC08L83/04C08K2201/005C08L2205/025C08L2205/03C08L2201/08C08K2003/2227C08K2003/2296C08K13/04C08K7/18C08K3/22
Inventor 朱雅东
Owner SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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