A thermocirculator
A thermal cycle device, cooling device technology, applied in the direction of biochemical cleaning device, enzymology/microbiology device, heating or cooling equipment, etc., to reduce heat transfer and improve accuracy
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Embodiment 1
[0024] figure 1 It is an exploded view of the thermal cycle device provided in Embodiment 1 of the present invention. Such as figure 1 As shown, the thermal cycle device includes a sample block 1 and N heating and cooling devices 2 .
[0025] In the embodiment of the present invention, the sample block 1 is provided with blind holes 11 arranged at uniform intervals to form a blind hole array. Blind holes 11 refer to the hole slots on the sample block 1 where PCR tubes can be placed. In the blind hole array, and the inner wall of the blind hole 11 is as close as possible to the outer wall of the tube of the PCR plate, which is beneficial to heat conduction. Biological samples are substances that need to undergo thermal cycle reactions, including but not limited to oligonucleotides used as primers, dNTP mixtures, Taq DNA polymerase, and PCR buffers. The upper parts of all blind holes 11 are connected. The connection part should be as close as possible to the opening of the ...
Embodiment 2
[0034] In this embodiment of the present invention, the basic structure of the thermal cycle device is the same as that of Embodiment 1, and the same components as in Embodiment 1 continue to use the same symbols as in Embodiment 1, including all the features described in Embodiment 1, which are not described herein. Let me repeat.
[0035] Figure 6 It is an exploded diagram of the thermal cycle device provided by the second embodiment of the present invention. Figure 7 It is a top view of the sample block provided by Embodiment 2 of the present invention. combine Figure 6 and Figure 7 , the thermal cycling device includes a sample block 1 , N heating and cooling devices 2 , and a pressing member 3 . The sample block 1 also includes an array of through holes arranged in the upper connected plane of the blind holes 11 . Through-holes 13 are provided between the connecting portion on the upper part of the blind holes 11 and the blind holes 11 . In the embodiment of the...
Embodiment 3
[0039] In this embodiment of the present invention, the basic structure of the thermal cycle device is the same as that of Embodiment 1 or Embodiment 2, and the components that are the same as Embodiment 1 or Embodiment 2 continue to use the same symbols, including all the features described therein, and are not described here. Let me repeat.
[0040] Figure 8 It is an exploded view of the thermal cycle device provided by Embodiment 3 of the present invention. Figure 9 It is a schematic diagram of the thermal cycle device provided in Embodiment 3 of the present invention. combine Figure 8 and Figure 9 , the thermal cycling device includes a sample block 1, N heating and cooling devices 2, a pressing member 3, a first heat conducting element 5, a TEC spacer 6, a second heat conducting element 7, a heat sink 8, a heat cover 9 and a bottom case 10 .
[0041] The bottom case 10 is used to bear all the weight of the thermal cycler. The heat sink 8 is fixed in the bottom c...
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