A kind of preparation method of semiconductor device

Abstract

The present application provides a method for preparing a semiconductor device, which relates to the technical field of semiconductor preparation technology. The method includes covering a wafer with a non-photosensitive material layer; covering the non-photosensitive material layer with a photosensitive material layer; forming a preset pattern on the non-photosensitive material layer to expose the wafer surface, wherein a first opening is formed on the photosensitive material layer, a second opening is formed on the non-photosensitive material layer, and the aperture of the first opening is smaller than the second opening. The diameter of the opening; forming a first depth groove on the exposed wafer; forming a second depth groove at the bottom of the first depth groove, wherein the width of the second depth groove is less than or equal to the width of the first depth groove; removing the wafer The remaining non-photosensitive material layer and photosensitive material layer. It can be formed by only one patterning process, which saves photolithography steps, reduces the steps of removing photoresist, and improves the preparation efficiency by reducing the number of photolithography times.

Description

technical field [0001] The present application relates to the technical field of semiconductor preparation technology, in particular to a method for preparing a semiconductor device. Background technique [0002] Photolithography is a process often used in the preparation of semiconductor devices. It belongs to a main process in the production of planar transistors and integrated circuits. The general photolithography process has to go through silicon wafer surface cleaning and drying, primer coating, spin coating photoresist, soft baking , alignment exposure, post-baking, developing, hard-baking, etching, detection and other processes, the visible lithography process is relatively complicated, and many steps are required to complete a lithography. For the formation of complex patterns in semiconductor devices, sometimes more than two photolithography steps are required to obtain the final pattern. In this way, the photolithography process makes the preparation of semiconduc...

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Problems solved by technology

[0002] Photolithography is a process often used in the preparation of semiconductor devices. It belongs to a main process in the production of planar transistors and integrated circuits. The general photolithography process has to go through silicon wafer surface cleaning and drying, primer coating, spin coating photoresist, soft baking , alignment exposure, post-baking, development, hard-baking, etching, detection and other processes, the visible lithography process is more complicated, and it takes many steps to complete a lithography

For the formation of complex patterns in semiconductor devices, sometimes it takes more than two photolithography steps to obtain the final pattern. In this way, the photolithography process makes the preparation of semiconductor devices take a long time and the preparation efficiency is low.

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