Sorting equipment for chip production

Abstract

The invention relates to sorting equipment for chip production, which comprises a base, a top plate, a moving device, a suction pump, an air inlet pipe, an air outlet pipe, a suction pipe, a suction cup, a dismounting and mounting mechanism, two clamping mechanisms and two supporting columns; the dismounting and mounting mechanism comprises a fixed ring, two positioning rods and two dismounting and mounting assemblies; each of the dismounting and mounting assemblies comprises a pulling plate, a fixed rod, two limiting blocks, two pieces of elastic cloth and a plurality of elastic ropes; and each of the clamping mechanisms comprises a power assembly, a branch pipe and a plurality of clamping assemblies. According to the sorting equipment for the chip production provided by the invention, through the dismounting and mounting mechanism, the convenience of dismounting and mounting the suction cup is improved, the workload of a user is reduced, and the practicability of the equipment is improved; by means of the clamping mechanisms, the function of fixing and clamping the positioning rods is achieved, the probability that the suction pipe is separated from the air inlet pipe when a chip is moved is reduced, therefore, the suction pipe is not prone to being separated from the air inlet pipe, and the stability of adsorbing the chip is improved.

Description

technical field [0001] The invention relates to the field of chip production, in particular to a sorting device for chip production. Background technique [0002] The conductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , although the holding tape bonded on the back is cut into several pieces, it is not cut off and becomes the state of holding each semiconductor chip. The chip is removed from the holding tape and placed in the chip carrier for subsequent assembly. This process is called chip sorting , Sorting will install the electrical performance to divide the chips into qualified products and unqualified products or into different grades. [0003] When the existing chip sorting equipment moves the chips, the chips are prone to greater wind resista...

AI Technical Summary

Problems solved by technology

[0003] When the existing chip sorting equipment moves the chips, the chips are prone to greater wind resistance, which easily increases the probability that the suction pipe on the suction cup will be separated from the air intake pipe, thereby reducing the stability of the suction cup for absorbing chips, and easily causing damage to the chips. The reliability of the existing chip sorting equipment is reduced. Not only that, the suction nozzle of the existing chip sorting equipment is easy to age after working for a period of time, so that the staff needs to replace the suction nozzle regularly. Because the process of disassembling and assembling the suction cup is relatively It is cumbersome and increases the workload of the staff, thus reducing the convenience of disassembling the suction cup

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