UV-cured silica gel for lead sealing

Abstract

The invention relates to the technical field of organic silicon photocuring new materials, and discloses UV curing silica gel for lead sealing, which is composed of the following components: 0 to 15 parts of a component A; 5 to 15 parts of a component B; 70 to 85 parts of a component C; 5 to 15 parts of a component D; 2.5 to 10 parts of a component E; 0.1 to 0.5 part of a component F; 0.2 to 1.0 part of a component G; and 10 to 25 parts of a component H; wherein the component A is methyl vinyl MDT type silicon resin, the component B is methyl vinyl MQ type silicon resin, the component C is high-viscosity (CH3)2(CH2=CH)SiO1 / 2 terminated linear structure polysiloxane, the component D is low-viscosity (CH3)2(CH2=CH)SiO1 / 2 terminated linear structure polysiloxane, the component E is terminal side hydrogen structure polysiloxane, the component F is a photoinitiator, the component G is an inhibitor, and the component H is magnetic powder. The magnetic powder is adopted to increase the bonding force between the lead and the metal surface, so that the silica gel still has higher bonding strength at high temperature, and the practicability of the optical adhesive is enhanced.

Description

technical field [0001] The invention relates to the technical field of new organic silicon light-curing materials, in particular to a UV-curing silicone gel for wire sealing. Background technique [0002] With the development of science and technology, people pay more and more attention to high-reliability electronic components, electrical power circuit modules and large-scale integrated circuits, and the lead sealing of each component during use has become a difficult problem. It will generate a lot of heat, which will cause the temperature of the lead wire to be too high and cause the product to fail. The traditional solution uses adhesive bonding, but the adhesive will have the problem of reduced bonding strength at high temperatures. [0003] Therefore, there is an urgent need to propose a UV-curable silicone gel for lead sealing to solve the problem of reduced bonding strength of traditional adhesives at high temperatures. Contents of the invention [0004] (1) Solve...

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Problems solved by technology

[0002] With the development of science and technology, people pay more and more attention to high-reliability electronic components, electrical power circuit modules and large-scale integrated circuits, and the lead sealing of each component during use has become a difficult problem. It will generate a lot of heat, which will cause the temperature of the lead wire to be too high and cause the product to fail. The traditional solution uses adhesive bonding, but the adhesive will have the problem of reduced bonding strength at high temperatures

[0003] Therefore, there is an urgent need to propose a UV-curable silicone gel for lead sealing to solve the problem of traditional adhesives reducing the bonding strength at high temperatures.

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