Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Isolated graph design method and device, storage medium and computer equipment

A graphic design and computer technology, applied in electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of no improvement in etching line width accuracy, increase process steps, etc., to avoid excessive copper thickness, reduce side erosion, avoid The effect of copper thickness exceeding the standard problem

Pending Publication Date: 2021-04-16
珠海杰赛科技有限公司 +1
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is only suitable for the positive film process, and the process steps are added. When etching graphics, the isolated lines are still in an isolated state, and there is no improvement in the accuracy of the etching line width.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Isolated graph design method and device, storage medium and computer equipment
  • Isolated graph design method and device, storage medium and computer equipment
  • Isolated graph design method and device, storage medium and computer equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0068] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0069] It should be noted that although the functional modules are divided in the system schematic diagram and the logical order is shown in the flow chart, in some cases, it can be executed in a different order than the module division in the system or the flow chart steps shown or described. The terms "first", "second" and the like in the specification and claims and the above drawings are used to distinguish similar objects, and not necessarily used to describe a specific sequence or sequence.

[0070] The basic process of making printed circuit boards is divided into positive film and negative...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an isolated graph design method and device, a storage medium and computer equipment. The method comprises: obtaining a circuit pattern of an isolated graph, obtaining a circuit pattern of the isolated graph, pre-designing an auxiliary pattern according to the circuit pattern of the isolated pattern, performing pattern transfer, electroplating and etching on the isolated pattern and the auxiliary pattern according to a positive film process, and performing pattern transfer and etching on the isolated pattern and the auxiliary pattern according to a negative film process to complete the design of the isolated pattern. According to the invention, by designing the auxiliary pattern, the problem of line width out-of-tolerance in the positive and negative sheet processes caused by pattern isolation can be avoided, and the problem that the copper thickness exceeds the standard in the positive sheet process can also be avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to an isolated graphic design method, device, storage medium and computer equipment. Background technique [0002] The basic process of printed circuit board production line is divided into positive film and negative film process, refer to Figure 1 to Figure 3 , the basic plan of the positive film process is: pattern transfer, pattern electroplating, pattern etching, and finally obtain the required circuit; refer to Figure 4 and Figure 5 , the basic plan of the negative film process is: pattern transfer, pattern etching, and finally get the required circuit. [0003] There are isolated graphics locally. When the positive graphics are electroplated, the current density of the isolated graphics is greater, and it is easy to have problems such as thicker copper thickness and sandwich film (the thickness of electroplated copper is higher than that of the anti-plating ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
Inventor 林荣富唐有军关志锋
Owner 珠海杰赛科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com