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Method, device, storage medium and computer equipment for determining isolated area

An area-determined and isolated technology, applied in the direction of computer design circuits, printed circuits, electrical components, etc., can solve problems such as etching short circuit, printed circuit board rework or scrapping, uneven distribution, etc., to ensure quality and avoid excessive copper thickness Effect

Active Publication Date: 2020-05-12
GUANGZHOU FASTPRINT CIRCUIT TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the randomness of the design of electronic circuits and graphics, there is a situation of uneven distribution. When the local position is too isolated, in the process of graphic electroplating, due to the electrochemical principle, the distribution of power lines in the isolated area is very dense, and the isolated area The local current is greater than the average current, which leads to the copper plating thickness of the isolated area pattern is much greater than the average value. Excessive copper thickness will cause a series of problems, such as: etching short circuit, printed circuit board needs to be reworked or scrapped, etc.

Method used

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  • Method, device, storage medium and computer equipment for determining isolated area
  • Method, device, storage medium and computer equipment for determining isolated area
  • Method, device, storage medium and computer equipment for determining isolated area

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Embodiment Construction

[0035] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0036] Pattern electroplating is an important process in the PCB manufacturing process. In the electroplating process, the electroplating current is an important factor affecting the thickness of electroplated copper. When the electrode is not polarized and not disturbed by other factors, due to the distance between the anode and the cathode, the high and low current distribution generated by it becomes the primary current distribution, and the primary current distribution depends entirely on the geometry of the plating tank , that is, the distance, arrangement, size, shap...

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Abstract

The invention relates to an isolated area determination method and device, a storage medium and computer equipment. The method includes the steps: acquiring a circuit design pattern of a circuit board; selecting a testing area from the circuit design pattern; determining the testing area as an isolated area. Before the printed circuit board is manufactured according to the circuit design pattern,the isolated area of the circuit design pattern is detected in advance according to the ratio of circuit diagram area to the area of the testing area, so that standard exceeding of copper thicknessesis avoided, and the quality of the printed circuit board is ensured.

Description

technical field [0001] The present application relates to the technical field of printed circuit boards, in particular to a method, device, storage medium and computer equipment for determining an isolated area. Background technique [0002] Printed Circuit Board (PCB) is a widely used electronic component. Its production process includes cutting, drilling, copper sinking, pattern transfer, pattern electroplating, film removal, etching and green oil, etc. , pattern electroplating refers to electroplating a copper layer with a required thickness on the exposed copper skin of the circuit pattern or on the wall of the hole. [0003] However, due to the randomness of the design of electronic circuits and graphics, there is a situation of uneven distribution. When the local position is too isolated, in the process of graphic electroplating, due to the electrochemical principle, the distribution of power lines in the isolated area is very dense, and the isolated area The local cu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0002H05K3/0005
Inventor 陈黎阳罗畅李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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