Automatic integrated circuit board edge grinding equipment

An integrated circuit board and board edge technology, which is applied in the field of automatic grinding equipment for integrated circuit board edges, can solve the problems of increasing the floor area of ​​the grinding device, increasing the labor intensity of the staff, and reducing the grinding efficiency of the grinding device, so as to increase the occupied area area effect

Inactive Publication Date: 2021-04-16
李得波
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the circuit board is manufactured, the edge of the circuit board needs to be polished. The existing circuit board edge grinding device usually grinds the circuit board during the transmission process, so it is necessary to ensure the length of the circuit board transmission path , thereby increasing the floor area of ​​the grinding device, and the existing circuit board grinding device requires the staff to continuously place the circuit board to be polished on the grinding device for grinding, which increases the labor intensity of the staff and reduces the grinding time. Grinding efficiency of the device

Method used

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  • Automatic integrated circuit board edge grinding equipment
  • Automatic integrated circuit board edge grinding equipment
  • Automatic integrated circuit board edge grinding equipment

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0036] refer to Figure 1-12 , an integrated circuit board edge automatic grinding equipment, including a mounting base 1, the upper surface of the mounting base 1 is fixedly connected with a support frame 2, and the inner surfaces of both sides of the support frame 2 are provided with a first chute 3, the first slide A travel switch 401 and a first stop switch 402 are respectively fixedly connected to the inner walls of both ends of the slot 3 , and a grinding device is provided on the inner wall of the first chute 3 , and the grinding device includes a threaded rod 4 .

[0037] The outer surfaces at both ends of the two threaded rods 4 are fixedly connected to the ...

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Abstract

The invention belongs to the technical field of integrated circuits, and particularly relates to automatic integrated circuit board edge grinding equipment which comprises a mounting base. A supporting frame is fixedly connected to the upper surface of the mounting base. According to the automatic integrated circuit board edge grinding equipment, a second micro gear motor drives a second connecting rod to rotate, then a supporting piece is driven to rotate through a discharging roller, the bottommost circuit board is driven to fall on a fixing disc, after the bottommost circuit board falls on the fixing disc, the penultimate circuit board falls on the supporting piece, a control switch on the supporting piece is pressed down, the second micro gear motor is powered off and stops, a ratchet wheel is limited by a pawl, and then the automatic feeding effect is achieved, so that the problems that according to an existing circuit board grinding device, a worker needs to continuously place a circuit board needing to be ground on the grinding device for grinding, the labor intensity of the worker is increased, and the grinding efficiency of the grinding device is reduced are solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an automatic grinding device for the edge of an integrated circuit board. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with the required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit, and it is a new type of semiconductor device developed in the late 1950s and 1960s. It is a semiconductor manufacturing process such as oxida...

Claims

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Application Information

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IPC IPC(8): B24B9/00B24B41/00B24B41/06B24B41/02H05K3/00
Inventor 李得波
Owner 李得波
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