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Device transfer printing treatment method and miniature microphone dustproof device transfer printing treatment method

A treatment method and technology of dust-proof device, which is applied in the direction of transferring ink from original manuscripts, printing of special varieties of printed matter, printing, etc., can solve problems such as easy peeling of devices and affect device performance, so as to improve product performance and increase anchorage. Dot area and the effect of reducing manufacturing cost

Active Publication Date: 2022-05-31
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the object of the present invention is to provide a device transfer treatment method and a micro-microphone dustproof device transfer treatment method to solve the problems existing in the existing transfer printing treatment method that the device is easy to be peeled off, thereby affecting the performance of the device.

Method used

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  • Device transfer printing treatment method and miniature microphone dustproof device transfer printing treatment method
  • Device transfer printing treatment method and miniature microphone dustproof device transfer printing treatment method
  • Device transfer printing treatment method and miniature microphone dustproof device transfer printing treatment method

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Embodiment Construction

[0032] FIG. 1 shows a flow of a device transfer processing method according to an embodiment of the present invention.

[0034] S110: Lay a sacrificial layer material on the substrate and form a sacrificial layer.

[0035] S120: An anchor point layer is provided on the side of the sacrificial layer away from the substrate, and the anchor point layer passes through the protrusions thereon and penetrates the sacrificial layer.

[0037] Since in the peeling process of the transfer belt, the separation of the anchor point structure and the sacrificial layer is gradually peeled off in one direction,

[0038] In a specific embodiment of the present invention, the anchor point structure can be set at the four edge positions of the anchor point layer, or

[0039] S130: Disposing a device on a side of the anchor layer away from the substrate.

[0041] Specifically, the device can be various forms of chips or dustproof structures, etc., when the device is transferred to the transfer belt

[0...

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Abstract

The invention provides a device transfer printing processing method and a miniature microphone dustproof device transfer printing processing method, wherein the device transfer processing method includes forming a sacrificial layer on a substrate; The point layer is fixedly connected to the substrate through the anchor point structure that protrudes and penetrates the sacrificial layer. The anchor point structure is arranged at least one edge position of the anchor point layer; the device is arranged on the side of the anchor point layer away from the substrate; the device and the The anchor layer on one side of the device is fixed on the transfer tape, and the anchor layer is peeled off from the sacrificial layer and the substrate to complete the transfer process of the device. The above invention can ensure that the devices on the sacrificial layer are not peeled off when the sacrificial layer is etched, thereby ensuring the adhesion of the devices.

Description

Device transfer processing method and transfer processing method of micro-microphone dustproof device technical field The present invention relates to the technical field of device transfer processing, more particularly, to a device transfer processing method, particularly In particular, it is a transfer processing method for a miniature microphone dustproof device. Background technique [0002] At present, in the manufacturing process of a device with a thin film, a transfer process is usually involved. It mainly refers to coating the sacrificial layer material on the substrate by dry peeling or wet peeling, and gradually forming the sacrificial layer on the sacrificial layer. The processing method of transferring to the tape after the device is completed. In the existing transfer processing process, it is impossible to realize the etching process of the sacrificial layer. For example, when the device is processed by wet etching, there is a case where the sacrificial...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41M3/12B41M5/025H04R31/00
CPCB41M3/12B41M5/025H04R31/003H04R31/00
Inventor 畠山庸平林育菁
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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