Multi-angle exposure equipment and manufacturing method of electroplated metal wire

Abstract

The invention discloses multi-angle exposure equipment and a manufacturing method of an electroplated metal wire, and the manufacturing method comprises the steps: forming a sub-metal wire layer on atransparent substrate, so a wire of the sub-metal wire layer is manufactured; forming a photoresist layer above the seed metal wire layer; taking the seed metal wire layer as a photomask layer, and performing scattering type exposure on the photoresist layer through the seed metal wire layer by using multi-angle exposure equipment; removing the unexposed photoresist layer to expose the seed metalwire layer; electroplating the seed metal wire layer to a predetermined thickness to form a metal wire layer; and removing the remaining photoresist layer. The method is simple in process, easy to implement and low in cost, and the yield of the high aspect ratio electroplating process is greatly improved.

Description

technical field [0001] The present invention relates to an electroplating metal technology, in particular to a multi-angle exposure equipment and a method for making electroplated metal wires. Background technique [0002] With the rapid development of portable electronic devices, the miniaturization of components, the reduction of circuit board line width, the improvement of precision, and the reduction of power consumption have made high-aspect-ratio copper electroplating process become a popular science. [0003] At present, the copper electroplating process with high aspect ratio can achieve a line width of 1 micron to 15 micron and a thickness of 10 micron to 100 micron. However, in order to achieve such precision, it must be realized through exposure and development process. In order to make high-aspect-ratio copper wires, it is necessary to form an extremely thin seed copper metal layer on the substrate, and then go through processes such as forming a photoresist lay...

AI Technical Summary

Problems solved by technology

This kind of process uses the technology of double-layer photoresist. To expose and develop the double-layer photoresist at the same time requires high technical strength and is not easy to manufacture.

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